公开(公告)号：US09241406B2

公开(公告)日：2016-01-19

申请号：US13938741

申请日：2013-07-10

Applicant: AU Optronics Corp.

Inventor： Yan-Li Fang ,  Po-Fu Huang ,  Chun-Ming Lin

IPC: H05K7/10 ,  G02F1/1345 ,  H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H05K3/40 ,  H05K3/24 ,  H01R9/00 ,  H05K7/00 ,  H05K1/00 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/112 ,  G02F1/1345 ,  G02F1/13458 ,  H05K1/0277 ,  H05K1/111 ,  H05K1/189 ,  H05K3/244 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/4076 ,  H05K2201/0969 ,  H05K2201/10128

Abstract: An electronic assembly includes a first substrate, at least one first conductive pad and multiple second conductive pads. The first substrate comprises a base layer and at least one conductive circuit layer. The at least one conductive circuit layer is disposed on the base layer. The at least one first conductive pad is disposed on the first substrate. The first conductive pad is electrically insulated from the conductive circuit layer. The first conductive pad includes multiple first holes. The second conductive pads are disposed on the first substrate. The second conductive pads are electrically connected to the conductive circuit layer.

Abstract translation: 电子组件包括第一基板，至少一个第一导电焊盘和多个第二导电焊盘。 第一衬底包括基极层和至少一个导电电路层。 至少一个导电电路层设置在基层上。 所述至少一个第一导电焊盘设置在所述第一基板上。 第一导电焊盘与导电电路层电绝缘。 第一导电焊盘包括多个第一孔。 第二导电焊盘设置在第一基板上。 第二导电焊盘电连接到导电电路层。

公开(公告)号：US20140104794A1

公开(公告)日：2014-04-17

申请号：US13938741

申请日：2013-07-10

Applicant: AU Optronics Corp.

Inventor： Yan-Li Fang ,  Po-Fu Huang ,  Chun-Ming Lin

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/112 ,  G02F1/1345 ,  G02F1/13458 ,  H05K1/0277 ,  H05K1/111 ,  H05K1/189 ,  H05K3/244 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/4076 ,  H05K2201/0969 ,  H05K2201/10128

Abstract: An electronic assembly includes a first substrate, at least one first conductive pad and multiple second conductive pads. The first substrate comprises a base layer and at least one conductive circuit layer. The at least one conductive circuit layer is disposed on the base layer. The at least one first conductive pad is disposed on the first substrate. The first conductive pad is electrically insulated from the conductive circuit layer. The first conductive pad includes multiple first holes. The second conductive pads are disposed on the first substrate. The second conductive pads are electrically connected to the conductive circuit layer.

Abstract translation: 电子组件包括第一基板，至少一个第一导电焊盘和多个第二导电焊盘。 第一衬底包括基极层和至少一个导电电路层。 至少一个导电电路层设置在基层上。 所述至少一个第一导电焊盘设置在所述第一基板上。 第一导电焊盘与导电电路层电绝缘。 第一导电焊盘包括多个第一孔。 第二导电焊盘设置在第一基板上。 第二导电焊盘电连接到导电电路层。