HEAT DISSIPATION HOLDER
    1.
    发明公开

    公开(公告)号:US20240008227A1

    公开(公告)日:2024-01-04

    申请号:US18154519

    申请日:2023-01-13

    IPC分类号: H05K7/20 F25B21/02

    摘要: A heat dissipation holder applied to a handheld electronic device is provided. The heat dissipation holder includes a base, a cover, a heat dissipation module, and an air guiding structure. The base includes a first side and a second side that are opposite to each other and a front surface and a rear surface that are opposite to each other. The first side includes a first opening. The cover is combined onto the front surface to form an accommodating space with the base. The cover includes an air inlet region. The heat dissipation module is disposed in the accommodating space. The air guiding structure is disposed on the cover and extends to the first opening. The first opening, the air inlet region, and the air guiding structure form an airflow channel between the heat dissipation module and the cover.

    THERMAL DISSIPATION HOLDER
    2.
    发明公开

    公开(公告)号:US20240008201A1

    公开(公告)日:2024-01-04

    申请号:US18154476

    申请日:2023-01-13

    摘要: A thermal dissipation holder for a handheld electronic device is provided. The thermal dissipation holder includes a main structure, a movable element, an elastic element, and a locker. The main structure has a front surface and a rear surface. The movable element is movably connected to the main structure along a first direction and has a clamp portion at a side away from the carrier. One end of the elastic element is connected to the main structure. The other end of the elastic element is connected to the movable element. The elastic element drives the movable element to move along the first direction. The locker is disposed in the main structure and has a locking portion, where a position of the locking portion corresponds to that of the clamp portion, and the locker is selectively engaged with the clamp portion through the locking portion to lock the movable element.

    THERMAL DISSIPATION DEVICE AND CONTROL METHOD THEREOF

    公开(公告)号:US20240008217A1

    公开(公告)日:2024-01-04

    申请号:US18157692

    申请日:2023-01-20

    IPC分类号: H05K7/20

    摘要: A thermal dissipation device for a handheld electronic device is provided. The thermal dissipation device includes a thermoelectric cooling chip, a temperature sensor, a humidity sensor, and a processing unit. The thermoelectric cooling chip has a cold surface and a hot surface. The cold surface is attached on a heating surface of the handheld electronic device by means of a heat conduction structure, and has a cold surface temperature. The temperature sensor and the humidity sensor are disposed in an area adjacent to the thermoelectric cooling chip for generating an environmental temperature and an environmental humidity respectively. The processing unit is configured to calculate a dew point temperature based on the environmental temperature and the environmental humidity; and determine whether to stop the thermoelectric cooling chip or not based on the cold surface temperature, the dew point temperature, and a heating surface temperature of the handheld electronic device.

    BUTTON MODULE
    4.
    发明公开
    BUTTON MODULE 审中-公开

    公开(公告)号:US20230223218A1

    公开(公告)日:2023-07-13

    申请号:US17898730

    申请日:2022-08-30

    IPC分类号: H01H21/22

    CPC分类号: H01H21/22

    摘要: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.