公开(公告)号：US10416572B2

公开(公告)日：2019-09-17

申请号：US16321867

申请日：2017-06-29

Applicant: ASML NETHERLANDS B.V.

Inventor： Hans Butler ,  Wim Symens ,  Bas Jansen

IPC: G03F7/20 ,  H02N2/06

Abstract: A positioning system including: a first body; a second body; and an actuator arranged between the first body and the second body to position the first body relative to the second body, wherein the actuator includes a first piezoelectric actuator and a second piezoelectric actuator arranged in series, wherein the first piezoelectric actuator has a first hysteresis, wherein the second piezoelectric actuator has a second hysteresis smaller than the first hysteresis, and wherein the second piezoelectric actuator has a positioning range at least equal to the first hysteresis.

公开(公告)号：US20230134837A1

公开(公告)日：2023-05-04

申请号：US18090873

申请日：2022-12-29

Applicant: ASML NETHERLANDS B.V.

Inventor： Johannes Onvlee ,  Antonius Franciscus Johannes De Groot ,  Wim Symens ,  David Ferdinand Vles

IPC: G03F7/20

Abstract: A substrate support for supporting a substrate. The substrate support includes a main body, a clamping device and a dither device. The main body includes a support surface for supporting the substrate. The clamping device is arranged to provide the clamping force to clamp the substrate on the support surface. The dither device is configured to dither the clamping force. The dither device may be configured to dither the clamping force while the substrate is being loaded onto the support surface.

公开(公告)号：US11556063B2

公开(公告)日：2023-01-17

申请号：US16092021

申请日：2017-03-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Johannes Onvlee ,  Antonius Franciscus Johannes De Groot ,  Wim Symens ,  David Ferdinand Vles

IPC: G03F7/20

Abstract: A substrate support for supporting a substrate. The substrate support comprises a main body, a clamping device and a dither device. The main body comprises a support surface for supporting the substrate. The clamping device is arranged to provide the clamping force to clamp the substrate on the support surface. The dither device is configured to dither the clamping force. The dither device may be configured to dither the clamping force while the substrate W is being loaded onto the support surface.

公开(公告)号：US12032301B2

公开(公告)日：2024-07-09

申请号：US18090873

申请日：2022-12-29

Applicant: ASML NETHERLANDS B.V.

Inventor： Johannes Onvlee ,  Antonius Franciscus Johannes De Groot ,  Wim Symens ,  David Ferdinand Vles

IPC: G03F7/00

CPC classification number: G03F7/70708 ,  G03F7/70691 ,  G03F7/707 ,  G03F7/70733

Abstract: A substrate support for supporting a substrate. The substrate support includes a main body, a clamping device and a dither device. The main body includes a support surface for supporting the substrate. The clamping device is arranged to provide the clamping force to clamp the substrate on the support surface. The dither device is configured to dither the clamping force. The dither device may be configured to dither the clamping force while the substrate is being loaded onto the support surface.