REACTOR MANIFOLDS
    1.
    发明申请

    公开(公告)号:US20230069359A1

    公开(公告)日:2023-03-02

    申请号:US18045419

    申请日:2022-10-10

    IPC分类号: C23C16/455

    摘要: Herein disclosed are systems and methods related to semiconductor processing device including a manifold including a bore configured to deliver a gas to a reaction chamber, the manifold including a first block mounted to a second block, the first and second mounted blocks cooperating to at least partially define the bore. The manifold may further comprise an insulator cap disposed about the first block or the second block. The semiconductor processing device may comprise at least three valve blocks mounted to the second block so that a precursor backflow is prevented. Heater rod(s) can extend through the second block to a location adjacent the first block.

    CHANNELED LIFT PIN
    2.
    发明申请

    公开(公告)号:US20210210373A1

    公开(公告)日:2021-07-08

    申请号:US17140661

    申请日:2021-01-04

    IPC分类号: H01L21/687 H01L21/683

    摘要: A reactor system may comprise a reaction chamber enclosed by a chamber sidewall, and a susceptor disposed in the reaction chamber between a reaction space and a lower chamber space comprised in the reaction chamber. The susceptor may comprise a pin hole disposed through the susceptor such that the pin hole is in fluid communication with the reaction space and the lower chamber space, and such that the reaction space is in fluid communication with the lower chamber space. A lift pin may be disposed in the pin hole. The lift pin may comprise a pin body comprising a pin channel, defined by a pin channel surface, disposed in the pin body such that the reaction space is in fluid communication with the lower chamber space when the lift pin is disposed in the pin hole.

    REACTOR MANIFOLDS
    5.
    发明申请
    REACTOR MANIFOLDS 审中-公开

    公开(公告)号:US20200299836A1

    公开(公告)日:2020-09-24

    申请号:US16813527

    申请日:2020-03-09

    摘要: Herein disclosed are systems and methods related to semiconductor processing device including a manifold including a bore configured to deliver a gas to a reaction chamber, the manifold including a first block mounted to a second block, the first and second mounted blocks cooperating to at least partially define the bore. A supply channel provides fluid communication between a gas source and the bore, and the supply channel is disposed at least partially in the second block. A metallic seal is disposed about the bore at an interface between the first and second block. Advantageously, the metallic seal improves sealing between the interface between the first block and the second block.

    Reactor manifolds
    6.
    发明授权

    公开(公告)号:US11492701B2

    公开(公告)日:2022-11-08

    申请号:US16813527

    申请日:2020-03-09

    摘要: Herein disclosed are systems and methods related to semiconductor processing device including a manifold including a bore configured to deliver a gas to a reaction chamber, the manifold including a first block mounted to a second block, the first and second mounted blocks cooperating to at least partially define the bore. A supply channel provides fluid communication between a gas source and the bore, and the supply channel is disposed at least partially in the second block. A metallic seal is disposed about the bore at an interface between the first and second block. Advantageously, the metallic seal improves sealing between the interface between the first block and the second block.