公开(公告)号：US20240329525A1

公开(公告)日：2024-10-03

申请号：US18742227

申请日：2024-06-13

申请人： ASAHI KASEI KABUSHIKI KAISHA

发明人： Tomohiro YORISUE ,  Taihei INOUE ,  Yoshito IDO ,  Mitsutaka NAKAMURA ,  Tomoshige YUNOKUCHI ,  Daisuke SASANO ,  Takahiro SASAKI

IPC分类号： G03F7/022 ,  C08K5/33 ,  C08K5/375 ,  C08L77/00 ,  G03F7/004 ,  G03F7/023 ,  G03F7/031 ,  G03F7/037 ,  G03F7/038 ,  G03F7/16 ,  H05K3/02 ,  H05K3/28

CPC分类号： G03F7/0226 ,  C08L77/00 ,  G03F7/0048 ,  G03F7/0233 ,  G03F7/031 ,  G03F7/037 ,  G03F7/0387 ,  G03F7/0388 ,  G03F7/162 ,  C08K5/33 ,  C08K5/375 ,  C08L2203/20 ,  H05K3/022 ,  H05K3/287 ,  H05K2201/0154

摘要： A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

公开(公告)号：US20190113845A1

公开(公告)日：2019-04-18

申请号：US15742975

申请日：2017-03-28

申请人： ASAHI KASEI KABUSHIKI KAISHA

发明人： Tomohiro YORISUE ,  Taihei INOUE ,  Yoshito IDO ,  Mitsutaka NAKAMURA ,  Tomoshige YUNOKUCHI ,  Daisuke SASANO ,  Takahiro SASAKI

IPC分类号： G03F7/022 ,  G03F7/037 ,  G03F7/004 ,  G03F7/031 ,  G03F7/16 ,  C08L77/00

摘要： A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

公开(公告)号：US20240210827A1

公开(公告)日：2024-06-27

申请号：US18396056

申请日：2023-12-26

申请人： ASAHI KASEI KABUSHIKI KAISHA

发明人： Tomohiro YORISUE ,  Taihei INOUE ,  Yoshito IDO ,  Mitsutaka NAKAMURA ,  Tomoshige YUNOKUCHI ,  Daisuke SASANO ,  Takahiro SASAKI

IPC分类号： G03F7/022 ,  C08L77/00 ,  G03F7/004 ,  G03F7/023 ,  G03F7/031 ,  G03F7/037 ,  G03F7/038 ,  G03F7/16

CPC分类号： G03F7/0226 ,  C08L77/00 ,  G03F7/0048 ,  G03F7/0233 ,  G03F7/031 ,  G03F7/037 ,  G03F7/0387 ,  G03F7/0388 ,  G03F7/162 ,  H05K3/287 ,  H05K2201/0154

摘要： A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

公开(公告)号：US20230221639A1

公开(公告)日：2023-07-13

申请号：US18124383

申请日：2023-03-21

申请人： ASAHI KASEI KABUSHIKI KAISHA

发明人： Tomohiro YORISUE ,  Mitsutaka NAKAMURA ,  Taihei INOUE

IPC分类号： G03F7/038

CPC分类号： G03F7/0387 ,  G03F7/0382

摘要： A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

公开(公告)号：US20180373147A1

公开(公告)日：2018-12-27

申请号：US16062229

申请日：2017-08-17

申请人： ASAHI KASEI KABUSHIKI KAISHA

发明人： Tomohiro YORISUE ,  Mitsutaka NAKAMURA ,  Taihei INOUE ,  Tatsuya HIRATA ,  Takahiro SASAKI

IPC分类号： G03F7/037 ,  G03F7/20 ,  C08L79/08

摘要： A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).