公开(公告)号：US20170283523A1

公开(公告)日：2017-10-05

申请号：US15628672

申请日：2017-06-21

Applicant: Asahi Glass Company, Limited

Inventor： Susumu SAITO ,  Wakako HASHIMOTO ,  Tetsuji SHIMOHIRA ,  Kazuo HAMAZAKl ,  Satoshi OTSUGU ,  Hiroki MATOBA

IPC: C08F6/12 ,  C08F6/00 ,  C08F2/06 ,  C08J3/16 ,  C08L27/12

CPC classification number: C08F6/12 ,  C08F2/06 ,  C08F6/003 ,  C08J3/16 ,  C08L27/12

Abstract: To provide a method capable of producing fluorinated polymer particles in which formation of fine particles or formation of large aggregates is sufficiently suppressed even in the case of a fluorinated polymer having high solubility in a solvent.The method comprises the following steps (i) and (ii), being a method for producing particles of a fluorinated polymer (A) which has either one or both of structural units (u1) derived from tetrafluoroethylene and structural units (u2) having no sulfonic acid type functional group and having a cyclic structure and fluorine atoms, and which has structural units (u3) having a sulfonic acid type functional group, wherein the proportion of the structural units (u1) is from 0 to 82 mol % in all structural units (100 mol %) in the fluorinated polymer (A): (i) a step of preparing solution or dispersion of the fluorinated polymer (A) having the above fluorinated polymer (A) dissolved or dispersed in a solvent (B), wherein the following conditions (i-1) and (i-2) are satisfied: (i-1) the solvent (B) contains a good solvent (B2) wherein the solubility of the fluorinated polymer (A) is at least 30%, (i-2) even when the above solution or dispersion of the fluorinated polymer (A) is passed through a filter of 200 mesh made of stainless steel, no residue remains on the filter, (ii) a step of mixing the above solution or dispersion of the fluorinated polymer (A) and a solvent (C) to aggregate the fluorinated polymer (A) to form particles of the fluorinated polymer (A), wherein the following conditions (ii-1) to (ii-3) are satisfied: (ii-1) the solvent (C) contains a poor solvent (C1) whereby the degree of swelling of the fluorinated polymer (A) is at most 100%, (ii-2) the degree of swelling of the fluorinated polymer (A) by a mixed solvent (BC) of the solvent (B) and the solvent (C) is from 70 to 250%, (ii-3) the ratio of the mass (WC) of the solvent (C) to the mass (WB) of the solvent (B) is from 1 to 5.

公开(公告)号：US20140335634A1

公开(公告)日：2014-11-13

申请号：US14445663

申请日：2014-07-29

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Wataru KASAI ,  Yoshiaki HIGUCHI ,  Masakazu ATAKU ,  Daisuke TAGUCHI ,  Satoshi OTSUGU

IPC: H01L33/56 ,  B29C43/50 ,  H01L33/58 ,  C08F214/26 ,  C08F10/06 ,  B29C43/18 ,  B29C37/00

CPC classification number: H01L33/56 ,  B29C33/56 ,  B29C33/68 ,  B29C37/0075 ,  B29C43/021 ,  B29C43/18 ,  B29C43/50 ,  B29C45/14655 ,  B29C2043/182 ,  B29C2043/3444 ,  B29C2045/14663 ,  B29K2083/00 ,  B29K2827/12 ,  B29L2011/0016 ,  B29L2031/3406 ,  B29L2031/3481 ,  C08F10/06 ,  C08F214/265 ,  C08J5/18 ,  C08J2327/18 ,  H01L21/566 ,  H01L24/97 ,  H01L33/58 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A mold release film, which is adapted to be disposed on the cavity surface of a mold to form a resin-encapsulated portion by encapsulating a semiconductor element of a semiconductor device with a curable encapsulation resin, has a tensile modulus of elasticity of from 10 to 24 MPa at 132° C. as measured in accordance with JIS K 7127, and a peak peel resistance of at most 0.8 N/25 mm.

Abstract translation: 适于通过用可固化密封树脂封装半导体器件的半导体元件而适于设置在模具的空腔表面上以形成树脂封装部分的脱模膜的拉伸弹性模量为10至 根据JIS K 7127测定，在132℃下为24MPa，峰值剥离阻力为0.8N / 25mm以下。