Abstract:
To provide a negative photosensitive resin composition which may be sufficiently cured even at a low exposure amount and which can impart good ink repellency to the upper surface of partition walls, a cured resin film and partition walls which have good ink repellency on the upper surface, and an optical element which has dots formed with good precision, having opening sections partitioned by partition walls uniformly coated with an ink.A negative photosensitive resin composition comprising an alkali-soluble resin or alkali-soluble monomer (A) having an ethylenic double bond, a photopolymerization initiator (B), a thiol compound (C) having at least 3 mercapto groups in one molecule, and an ink repellent agent (D), a cured resin film and partition walls formed by using the negative photosensitive resin composition, and an optical element having the partition walls located between a plurality of dots and their adjacent dots on a substrate surface.
Abstract:
To provide a negative photosensitive resin composition for an optical element having good ink repellency and capable of reducing a residue at opening sections, a cured resin film for an optical element having good ink repellency, partition walls for an optical element capable of forming a high-precision pattern, and an optical element having such partition walls. A negative photosensitive resin composition comprising a photocurable alkali-soluble resin or alkali-soluble monomer (A), a photopolymerization initiator (B), a reactive ultraviolet absorber (C), a polymerization inhibitor (D), and an ink repellent (E); a cured film and partition walls formed by using the negative photosensitive resin composition; or an organic EL element, a quantum dot display, a TFT array, or a thin-film solar cell, having such partition walls positioned between a plurality of dots and their adjacent dots on a substrate surface.