公开(公告)号：US20220181115A1

公开(公告)日：2022-06-09

申请号：US17115656

申请日：2020-12-08

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Adam Faust ,  Yosef Basson ,  Guy Eytan ,  Yonathan David

IPC: H01J37/20 ,  H01L21/683 ,  H01L21/67 ,  G01N27/04 ,  H01J37/28

Abstract: A method, a non-transitory computer readable medium and a device. The method may include (a) introducing a voltage difference between an absolute value of a negative pole of the electrostatic chuck and an absolute value of a positive pole of the electrostatic chuck, the introducing occurs while the wafer is supported by the electrostatic chuck and is contacted by one or more conductive contact pins of the electrostatic chuck; (b) monitoring, by an electrostatic sensor that comprises a sensing element, a charge at a point of measurement located at a front side of the wafer, at different points of time that follow a start of the introducing of the voltage difference, to provide monitoring results; and (c) determining an electrical parameter of the contact between the wafer and the electrostatic chuck, based on the monitoring results.

公开(公告)号：US11694869B2

公开(公告)日：2023-07-04

申请号：US17115656

申请日：2020-12-08

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Adam Faust ,  Yosef Basson ,  Guy Eytan ,  Yonathan David

IPC: H01J37/20 ,  H01L21/683 ,  H01L21/67 ,  G01N27/04 ,  H01J37/28

CPC classification number: H01J37/20 ,  G01N27/041 ,  H01J37/28 ,  H01L21/67259 ,  H01L21/6831

Abstract: A method, a non-transitory computer readable medium and a device. The method may include (a) introducing a voltage difference between an absolute value of a negative pole of the electrostatic chuck and an absolute value of a positive pole of the electrostatic chuck, the introducing occurs while the wafer is supported by the electrostatic chuck and is contacted by one or more conductive contact pins of the electrostatic chuck; (b) monitoring, by an electrostatic sensor that comprises a sensing element, a charge at a point of measurement located at a front side of the wafer, at different points of time that follow a start of the introducing of the voltage difference, to provide monitoring results; and (c) determining an electrical parameter of the contact between the wafer and the electrostatic chuck, based on the monitoring results.