公开(公告)号：US20140262043A1

公开(公告)日：2014-09-18

申请号：US13798028

申请日：2013-03-12

Applicant: APPLIED MATERIALS, INC.

Inventor： LARRY FRAZIER ,  CHENG-HSIUNG MATTHEW TSAI ,  JOHN C. FORSTER ,  MEI PO YEUNG ,  MICHAEL S. JACKSON

IPC: H01L21/683

Abstract: Methods and apparatus for processing substrates are disclosed herein. In some embodiments, a substrate support to support a substrate in a processing chamber includes a dielectric insulator plate; a conductive plate supported on the dielectric insulator plate, the conductive plate comprising a top surface and a bottom surface defining a thickness between the top surface and the bottom surface, wherein an edge portion of the conductive plate tapers in a radially outward direction; and a dielectric plate comprising a substrate support surface disposed upon the top surface of the conductor plate.

Abstract translation: 本文公开了处理衬底的方法和设备。 在一些实施例中，用于在处理室中支撑衬底的衬底支撑件包括介电绝缘板; 所述导电板包括顶表面和底表面，所述导电板限定所述顶表面和所述底表面之间的厚度，其中所述导电板的边缘部分在径向向外的方向上逐渐变细; 以及电介质板，其包括设置在所述导体板的顶表面上的衬底支撑表面。

公开(公告)号：US20140262764A1

公开(公告)日：2014-09-18

申请号：US13798021

申请日：2013-03-12

Applicant: APPLIED MATERIALS, INC.

Inventor： ALAN RITCHIE ,  JOHN C. FORSTER ,  MUHAMMAD RASHEED

IPC: C23C14/34

Abstract: Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, a process kit shield for use in a physical vapor deposition chamber may include an electrically conductive body having one or more sidewalls defining a central opening, wherein the body has a ratio of a surface area of inner facing surfaces of the one or more sidewalls to a height of the one or more sidewalls of about 2 to about 3.

Abstract translation: 本文提供了用于物理气相沉积的方法和装置。 在一些实施例中，用于物理气相沉积室的工艺组件屏蔽件可以包括具有限定中心开口的一个或多个侧壁的导电体，其中主体具有一个或多个内表面的表面面积的比率 更多侧壁到一个或多个侧壁的高度为约2至约3。

公开(公告)号：US20200020509A1

公开(公告)日：2020-01-16

申请号：US16578602

申请日：2019-09-23

Applicant: APPLIED MATERIALS, INC.

Inventor： DAPING YAO ,  HYMAN W.H. LAM ,  JOHN C. FORSTER ,  JIANG LU ,  CAN XU ,  DIEN-YEH WU ,  PAUL F. MA ,  MEI CHANG

IPC: H01J37/32 ,  C23C16/513 ,  C23C16/505 ,  C23C16/52 ,  C23C16/455

Abstract: Embodiments of a gas delivery apparatus for use in a radio frequency (RF) processing apparatus are provided herein. In some embodiments, a gas delivery apparatus for use in a radio frequency (RF) processing apparatus includes: a conductive gas line having a first end and a second end; a first flange coupled to the first end; a second flange coupled to the second end, wherein the conductive gas line extends through and between the first and second flanges; and a block of ferrite material surrounding the conductive gas line between the first and second flanges.

公开(公告)号：US20190196461A1

公开(公告)日：2019-06-27

申请号：US16227795

申请日：2018-12-20

Applicant: APPLIED MATERIALS, INC.

Inventor： DINESH SAIGAL ,  SARIL RAGHU ,  ALFRED LINKE ,  AN BAO TRAN ,  GIL ONTIVEROS ,  JOHN C. FORSTER ,  WARREN WOODS

IPC: G05B23/02 ,  G05B19/418 ,  G06F11/07

CPC classification number: G05B23/0283 ,  G05B19/4184 ,  G05B23/0216 ,  G05B23/0275 ,  G05B2223/06 ,  G06F11/0793

Abstract: A system, apparatus and method for internet-based health and diagnostic monitoring of semiconductor manufacturing components include receiving health and diagnostic information and data from at least one component of a semiconductor manufacturing system, evaluating the received health and diagnostic information and data to determine if at least one of the at least one component of the semiconductor manufacturing system for which the health and diagnostic information and data was received is faulty, and if determined that at least one of the at least one component of the semiconductor manufacturing system is faulty, initiating a corrective action for the faulty component over the internet.

公开(公告)号：US20180012732A1

公开(公告)日：2018-01-11

申请号：US15642002

申请日：2017-07-05

Applicant: APPLIED MATERIALS, INC.

Inventor： DAPING YAO ,  HYMAN W.H. LAM ,  JOHN C. FORSTER ,  JIANG LU ,  CAN XU ,  DIEN-YEH WU ,  PAUL F. MA ,  MEI CHANG

IPC: H01J37/32 ,  C23C16/505 ,  C23C16/513 ,  C23C16/52 ,  C23C16/455 ,  C23C16/06

CPC classification number: H01J37/3244 ,  C23C16/06 ,  C23C16/455 ,  C23C16/45563 ,  C23C16/45572 ,  C23C16/505 ,  C23C16/509 ,  C23C16/513 ,  C23C16/52 ,  H01J2237/002 ,  H01J2237/0213 ,  H01J2237/3321

Abstract: Embodiments of a gas delivery apparatus for use in a radio frequency (RF) processing apparatus are provided herein. In some embodiments, a gas delivery apparatus for use in a radio frequency (RF) processing apparatus includes: a conductive gas line having a first end and a second end; a first flange coupled to the first end; a second flange coupled to the second end, wherein the conductive gas line extends through and between the first and second flanges; and a block of ferrite material surrounding the conductive gas line between the first and second flanges.