公开(公告)号：US20240073576A1

公开(公告)日：2024-02-29

申请号：US18228883

申请日：2023-08-01

Applicant: APPLE INC.

Inventor： Geng Luo ,  Shota Aoyagi ,  Timothy Emmott Torres ,  Sarah B. Gysbers ,  Qigen Ji

IPC: H04R1/10

CPC classification number: H04R1/1016

Abstract: An in-ear headphone that includes a device housing that defines an interior cavity; a primary acoustic port formed through the device housing; an acoustic driver disposed within the device housing and aligned to emit sound through the primary acoustic port; a deformable ear tip having a sound channel formed through its length and coupled to the device housing such that the sound channel is aligned with the primary acoustic port; and a magnetic alignment system comprising a first set of magnets coupled to the device housing and a second set of magnets coupled to the deformable ear tip, the magnetic alignment system configured to removably couple the deformable ear tip to the device housing and align the ear tip so that it can only be coupled to the device housing in a single orientation.

公开(公告)号：US20230078536A1

公开(公告)日：2023-03-16

申请号：US17832346

申请日：2022-06-03

Applicant: Apple Inc.

Inventor： Ali N. Ergun ,  Bilal Mohamed Ibrahim Kani ,  Chang Liu ,  Ethan L. Huwe ,  Jeffrey J. Terlizzi ,  Jerzy S. Guterman ,  Jue Wang ,  Kishore N. Renjan ,  Kyusang Kim ,  Lan H. Hoang ,  Mandar S. Painaik ,  Manoj Vadeentavida ,  Sarah B. Gysbers ,  Takayoshi Katahira ,  Zhiqi Wang

IPC: H05K1/02 ,  H05K1/11 ,  H01Q1/22 ,  H01Q1/36

Abstract: System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.