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公开(公告)号：US11410977B2
公开(公告)日：2022-08-09
申请号：US16681136
申请日：2019-11-12
Inventor： John D. Brazzle , Frederick E. Beville , Yucheng Ying , Zafer S. Kutlu
Abstract: An electronic module can include a first integrated device package comprising a first substrate and an electronic component mounted to the first substrate. A first vertical interconnect can be mounted to and electrically connected to the first substrate. The first vertical interconnect can extend outwardly from the first substrate. The electronic module can include a second integrated device package comprising a second substrate and a second vertical interconnect having a first end mounted to and electrically connected to the second substrate. The second vertical interconnect can have a second end electrically connected to the first vertical interconnect. The first and second vertical interconnects can be disposed between the first and second substrates.
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公开(公告)号：US20200152614A1
公开(公告)日：2020-05-14
申请号：US16681136
申请日：2019-11-12
Inventor： John D. Brazzle , Frederick E. Beville , Yucheng Ying , Zafer S. Kutlu
Abstract: An electronic module can include a first integrated device package comprising a first substrate and an electronic component mounted to the first substrate. A first vertical interconnect can be mounted to and electrically connected to the first substrate. The first vertical interconnect can extend outwardly from the first substrate. The electronic module can include a second integrated device package comprising a second substrate and a second vertical interconnect having a first end mounted to and electrically connected to the second substrate. The second vertical interconnect can have a second end electrically connected to the first vertical interconnect. The first and second vertical interconnects can be disposed between the first and second substrates.
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