公开(公告)号：US20230378398A1

公开(公告)日：2023-11-23

申请号：US18030725

申请日：2021-10-08

Applicant: ams-OSRAM International GmbH

Inventor： Andreas REITH ,  Joerg SORG ,  Nikolaus GMEINWIESER ,  Dominik SCHOLZ ,  Manfred WOLF

IPC: H01L33/50 ,  H01L33/46 ,  H01L33/26 ,  H01L33/00 ,  H01L33/62 ,  H01L25/16

CPC classification number: H01L33/50 ,  H01L33/46 ,  H01L33/26 ,  H01L33/0008 ,  H01L33/62 ,  H01L25/167

Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being bevelled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.

公开(公告)号：US20240372318A1

公开(公告)日：2024-11-07

申请号：US18689881

申请日：2022-09-09

Applicant: AMS-OSRAM INTERNATIONAL GMBH

Inventor： Norwin VON MALM ,  Dominik SCHOLZ

IPC: H01S5/024

Abstract: An optoelectronic semiconductor component includes a semiconductor body having a first region of a first conductivity, a second region of a second conductivity and an active region. Further, the semiconductor component includes a first metallic heat sink, a second metallic heat sink and a thin film insulation layer. The first heat sink and the second heat sink are arranged on a mounting side of the semiconductor body. The first heat sink electrically contacts the first region. The thin film insulation layer electrically insulates the first heat sink from the second heat sink. The thin film insulation layer is in direct contact with the first heat sink and the second heat sink.

公开(公告)号：US20230187588A1

公开(公告)日：2023-06-15

申请号：US18164390

申请日：2023-02-03

Applicant: Ams-OSRAM International GmbH

Inventor： Andreas REITH ,  Joerg SORG ,  Nikolaus GMEINWIESER ,  Dominik SCHOLZ ,  Manfred WOLF

IPC: H01L33/48 ,  H01L25/13 ,  H01L33/60 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L33/486 ,  H01L25/13 ,  H01L33/60 ,  H01L33/62 ,  H01L24/24 ,  H01L24/20 ,  H01L2933/0058 ,  H01L2224/214 ,  H01L2224/24137

Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being beveled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.