Heat dissipation device
    1.
    发明授权

    公开(公告)号:US10334754B2

    公开(公告)日:2019-06-25

    申请号:US15703977

    申请日:2017-09-13

    申请人: AIC INC.

    IPC分类号: H05K7/20 G06F1/20

    摘要: A heat dissipation device including a mounting seat, a fan hung on the mounting seat and a frame connected with the fan is provided. The fan has an air outlet and an air inlet opposite to the air outlet, the air inlet is disposed facing to the mounting seat, the frame is arranged surrounding the air inlet and clamped between the mounting seat and the air inlet. Thereby, a back flowing hot airflow is prevented from being sucked into the air inlet.