Invention Grant
- Patent Title: Heat dissipation device
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Application No.: US15703977Application Date: 2017-09-13
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Publication No.: US10334754B2Publication Date: 2019-06-25
- Inventor: Kuo-Tsung Sun , Chung-I Kuo , Ta-Chih Chung
- Applicant: AIC INC.
- Applicant Address: TW Taoyuan
- Assignee: AIC INC.
- Current Assignee: AIC INC.
- Current Assignee Address: TW Taoyuan
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A heat dissipation device including a mounting seat, a fan hung on the mounting seat and a frame connected with the fan is provided. The fan has an air outlet and an air inlet opposite to the air outlet, the air inlet is disposed facing to the mounting seat, the frame is arranged surrounding the air inlet and clamped between the mounting seat and the air inlet. Thereby, a back flowing hot airflow is prevented from being sucked into the air inlet.
Public/Granted literature
- US20190082558A1 HEAT DISSIPATION DEVICE Public/Granted day:2019-03-14
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