Method of Manufacturing Printed Circuit Boards

    公开(公告)号:US20230159779A1

    公开(公告)日:2023-05-25

    申请号:US17920082

    申请日:2021-04-20

    申请人: AGFA-GEVAERT NV

    IPC分类号: C09D11/38 C09D11/32 H05K3/00

    摘要: A method of manufacturing a Printed Circuit Board (PCB) including an inkjet printing step wherein a radiation curable inkjet ink comprising at least one polymerizable compound and at least one photoinitiator is jetted and cured on a substrate, characterized in that the at least one photoinitiator has a chemical structure according to Formula I, wherein X represents a halogen; R1 is selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted and unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted alkyl group and a substituted or unsubstituted aryl or heteroaryl group; R2 and R3 are independently from each other selected from the group consisting of a hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstitited alkoxy group, a substituted or unsubstituted aryloxy group and a halogen; R1 together with R2 and R2 together with R3 may represent the necessary atoms to form a five to eight membered ring.