公开(公告)号：US20240332502A1

公开(公告)日：2024-10-03

申请号：US18488044

申请日：2023-10-17

Applicant: AESC Japan Ltd.

Inventor： Peng Huang ,  Ruonan Li ,  Zhonggui Sun ,  Huayu Sun

IPC: H01M4/36 ,  C01G53/00 ,  H01G11/32 ,  H01G11/66 ,  H01G11/86 ,  H01M4/133 ,  H01M4/134 ,  H01M4/38 ,  H01M4/587 ,  H01M10/0525

CPC classification number: H01M4/366 ,  C01G53/50 ,  H01G11/32 ,  H01G11/66 ,  H01G11/86 ,  H01M4/133 ,  H01M4/134 ,  H01M4/386 ,  H01M4/587 ,  H01M10/0525 ,  H01M2004/021 ,  H01M2004/027

Abstract: A silicon-carbon composite material, a preparation method thereof, an electrochemical device, and an electronic apparatus are provided. The silicon-carbon composite material includes an inner core and a carbon coating layer. The inner core includes a carbon substrate and silicon and carbon nanoparticles attached to a surface of the carbon substrate and/or an inner portion of the carbon substrate. An accessible porosity R is 20% to 80%. The preparation method includes co-depositing, by using a gaseous carbon source/silicon source carbon, carbon and silicon on the carbon substrate through a first chemical vapor deposition and forming, by using a carbon source, the carbon coating layer on a surface through a second chemical vapor deposition.

公开(公告)号：US20240332518A1

公开(公告)日：2024-10-03

申请号：US18476208

申请日：2023-09-27

Applicant: AESC Japan Ltd.

Inventor： Peng Huang ,  Ruonan Li ,  Zhonggui Sun ,  Huayu Sun

IPC: H01M4/38 ,  H01M4/04

CPC classification number: H01M4/386 ,  H01M4/0404 ,  H01M4/0428 ,  H01M2004/021 ,  H01M2004/027

Abstract: A silicon-carbon composite material, a preparation method thereof, an electrochemical device, and an electronic apparatus are provided. The silicon-carbon composite material includes a carbon substrate, a silicon material attached to a surface of the carbon substrate and/or an inner portion of the carbon substrate, and a nonmetal element doped on the carbon substrate. Covalent bond energy formed by the nonmetal element and a carbon element in is 180 eV≤E1≤700 eV or 130 eV≤E2≤210 eV.