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公开(公告)号：US11837596B2
公开(公告)日：2023-12-05
申请号：US18145261
申请日：2022-12-22
Inventor： Cyprian Emeka Uzoh , Arkalgud R. Sitaram , Paul Enquist
IPC: H01L25/00 , H01L23/31 , H01L21/56 , H01L21/304 , H01L21/306 , H01L21/308 , H01L21/683 , H01L25/065
CPC classification number: H01L25/50 , H01L21/304 , H01L21/306 , H01L21/3081 , H01L21/561 , H01L21/683 , H01L23/3121 , H01L23/3135 , H01L25/0657 , H01L2225/06513 , H01L2225/06541 , H01L2924/1304 , H01L2924/1434 , H01L2924/1461 , H01L2924/351 , H01L2924/3511 , H01L2924/3511 , H01L2924/00 , H01L2924/1434 , H01L2924/00012 , H01L2924/1461 , H01L2924/00012 , H01L2924/1304 , H01L2924/00012
Abstract: In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.
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Patent Agency Ranking
公开(公告)号：US20240145458A1
公开(公告)日：2024-05-02
申请号：US18399478
申请日：2023-12-28
Inventor： Cyprian Emeka Uzoh , Arkalgud R. Sitaram , Paul Enquist
IPC: H01L25/00 , H01L21/304 , H01L21/306 , H01L21/308 , H01L21/56 , H01L21/683 , H01L23/31 , H01L25/065
CPC classification number: H01L25/50 , H01L21/304 , H01L21/306 , H01L21/3081 , H01L21/561 , H01L21/683 , H01L23/3121 , H01L23/3135 , H01L25/0657 , H01L2225/06513 , H01L2225/06541 , H01L2924/1304 , H01L2924/1434 , H01L2924/1461 , H01L2924/351 , H01L2924/3511
Abstract: In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.
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公开(公告)号：US20230131849A1
公开(公告)日：2023-04-27
申请号：US18145261
申请日：2022-12-22
Inventor： Cyprian Emeka Uzoh , Arkalgud R. Sitaram , Paul Enquist
IPC: H01L25/00 , H01L23/31 , H01L21/56 , H01L21/304 , H01L21/306 , H01L21/308 , H01L21/683 , H01L25/065
Abstract: In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.
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公开(公告)号：US11658173B2
公开(公告)日：2023-05-23
申请号：US17131329
申请日：2020-12-22
Inventor： Cyprian Emeka Uzoh , Arkalgud R. Sitaram , Paul Enquist
IPC: H01L25/00 , H01L23/31 , H01L21/56 , H01L21/304 , H01L21/306 , H01L21/308 , H01L21/683 , H01L25/065
CPC classification number: H01L25/50 , H01L21/304 , H01L21/306 , H01L21/3081 , H01L21/561 , H01L21/683 , H01L23/3121 , H01L23/3135 , H01L25/0657 , H01L2225/06513 , H01L2225/06541 , H01L2924/1304 , H01L2924/1434 , H01L2924/1461 , H01L2924/351 , H01L2924/3511 , H01L2924/3511 , H01L2924/00 , H01L2924/1434 , H01L2924/00012 , H01L2924/1461 , H01L2924/00012 , H01L2924/1304 , H01L2924/00012
Abstract: In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.
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公开(公告)号：US20230130580A1
公开(公告)日：2023-04-27
申请号：US18145282
申请日：2022-12-22
Inventor： Cyprian Emeka Uzoh , Arkalgud R. Sitaram , Paul Enquist
IPC: H01L25/00 , H01L23/31 , H01L21/56 , H01L21/304 , H01L21/306 , H01L21/308 , H01L21/683 , H01L25/065
Abstract: In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.
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公开(公告)号：US12113056B2
公开(公告)日：2024-10-08
申请号：US18145282
申请日：2022-12-22
Inventor： Cyprian Emeka Uzoh , Arkalgud R. Sitaram , Paul Enquist
IPC: H01L25/00 , H01L21/304 , H01L21/306 , H01L21/308 , H01L21/56 , H01L21/683 , H01L23/31 , H01L25/065
CPC classification number: H01L25/50 , H01L21/304 , H01L21/306 , H01L21/3081 , H01L21/561 , H01L21/683 , H01L23/3121 , H01L23/3135 , H01L25/0657 , H01L2225/06513 , H01L2225/06541 , H01L2924/1304 , H01L2924/1434 , H01L2924/1461 , H01L2924/351 , H01L2924/3511 , H01L2924/3511 , H01L2924/00 , H01L2924/1434 , H01L2924/00012 , H01L2924/1461 , H01L2924/00012 , H01L2924/1304 , H01L2924/00012
Abstract: In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.
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