公开(公告)号：US11848284B2

公开(公告)日：2023-12-19

申请号：US17834737

申请日：2022-06-07

Applicant: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

Inventor： Javier A DeLaCruz ,  Belgacem Haba ,  Rajesh Katkar

IPC: H01L23/00 ,  H01L21/66 ,  H01L23/528

CPC classification number: H01L23/573 ,  H01L22/34 ,  H01L23/528 ,  H01L23/562 ,  H01L24/05 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/49 ,  H01L2224/08237 ,  H01L2224/29082 ,  H01L2224/29187 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/49171 ,  H01L2224/73215

Abstract: A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over at least a portion of the active circuitry. The obstructive material can be configured to obstruct external access to the active circuitry. The bonded structure can include a disruption structure configured to disrupt functionality of the at least a portion of the active circuitry upon debonding of the protective element from the semiconductor element.