公开(公告)号：US12205882B2

公开(公告)日：2025-01-21

申请号：US17754028

申请日：2020-09-17

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kayla C. Niccum ,  Ankit Mahajan ,  Saagar A. Shah ,  Kara A. Meyers ,  Mikhail L. Pekurovsky ,  Jonathan W. Kemling ,  David C. Mercord ,  Pranati Mondkar

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.

公开(公告)号：US20220367325A1

公开(公告)日：2022-11-17

申请号：US17754028

申请日：2020-09-17

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kayla C. Niccum ,  Ankit Mahajan ,  Saagar A. Shah ,  Kara A. Meyers ,  Mikhail L. Pekurovsky ,  Jonathan W. Kemling ,  David C. Mercord ,  Pranati Mondkar

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.