公开(公告)号：US20160212549A1

公开(公告)日：2016-07-21

申请号：US14832590

申请日：2015-08-21

申请人： Guojun Liu ,  Peng Zeng ,  Zhijiang Wu

发明人： Guojun Liu ,  Peng Zeng ,  Zhijiang Wu

IPC分类号： H04R19/04

CPC分类号： H04R19/04 ,  H04R2201/003 ,  H04R2225/49

摘要： A micro-electro-mechanical system (MEMS) microphone device is provided in the present disclosure. The MEMS microphone device includes a first electromagnetic shielding cover defining a first accommodating space; a second electromagnetic shielding cover received in the first accommodating space and defining a second accommodating space; a MEMS chip and an application specific integrated circuit (ASIC) chip received in the second accommodating space. The first electromagnetic shielding cover and the second electromagnetic shielding cover cooperatively provide dual electromagnetic shielding protection for the MEMS chip and the ASIC chip.

摘要翻译： 在本公开中提供了微机电系统（MEMS）麦克风装置。 MEMS麦克风装置包括限定第一容纳空间的第一电磁屏蔽罩; 第二电磁屏蔽盖，容纳在所述第一容纳空间中并限定第二容纳空间; MEMS芯片和专用集成电路（ASIC）芯片接收在第二容纳空间中。 第一电磁屏蔽罩和第二电磁屏蔽罩协同提供MEMS芯片和ASIC芯片的双电磁屏蔽保护。

公开(公告)号：US20160212517A1

公开(公告)日：2016-07-21

申请号：US14832735

申请日：2015-08-21

申请人： Guojun Liu ,  Peng Zeng ,  Zhijiang Wu

发明人： Guojun Liu ,  Peng Zeng ,  Zhijiang Wu

IPC分类号： H04R1/08

CPC分类号： H04R1/04 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R2201/003

摘要： A micro-electro-mechanical system (MEMS) microphone device is provided in the present disclosure. The MEMS microphone device includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a metal shielding member disposed between the electronic components and the electromagnetic shielding cover. The electromagnetic shielding cover has an inner surface and an outer surface; and at least one of the inner surface and the outer surface is provided with a first metal shielding layer. At least one of the electromagnetic shielding cover and the metal shielding member is electrically connected to the circuit board.

摘要翻译： 在本公开中提供了微机电系统（MEMS）麦克风装置。 MEMS麦克风装置包括电路板，安装在电路板上以限定容纳空间的电磁屏蔽盖，容纳在容纳空间中并电连接到电路板的电子部件和设置在电子部件和 电磁屏蔽罩。 电磁屏蔽罩具有内表面和外表面; 并且内表面和外表面中的至少一个设置有第一金属屏蔽层。 电磁屏蔽罩和金属屏蔽构件中的至少一个电连接到电路板。

公开(公告)号：US20150189446A1

公开(公告)日：2015-07-02

申请号：US14284651

申请日：2014-05-22

申请人： Kai Wang ,  Zhijiang Wu

发明人： Kai Wang ,  Zhijiang Wu

IPC分类号： H04R19/04

CPC分类号： H04R19/04 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R19/005 ,  H01L2924/00014

摘要： A silicon condenser microphone is disclosed. The silicon condenser microphone includes a substrate having a top surface, a lower surface opposed to the top surface, and a recess concave from the top surface toward the lower surface. The recess includes a bottom for carrying a chip thereon. The microphone further includes a transducer spanning the recess. By virtue of this configuration, the size of the microphone is reduced, and acoustic performance of the microphone is accordingly improved.

摘要翻译： 公开了一种硅电容麦克风。 硅电容麦克风包括具有顶表面，与顶表面相对的下表面以及从顶表面向下表面凹陷的凹槽的基底。 凹部包括用于在其上承载芯片的底部。 麦克风还包括跨越凹部的传感器。 凭借这种配置，麦克风的尺寸减小，麦克风的声学性能相应提高。

公开(公告)号：US09264815B2

公开(公告)日：2016-02-16

申请号：US14284651

申请日：2014-05-22

申请人： Kai Wang ,  Zhijiang Wu

发明人： Kai Wang ,  Zhijiang Wu

IPC分类号： H04R19/04 ,  H04R19/00

CPC分类号： H04R19/04 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R19/005 ,  H01L2924/00014

摘要： A silicon condenser microphone is disclosed. The silicon condenser microphone includes a substrate having a top surface, a lower surface opposed to the top surface, and a recess concave from the top surface toward the lower surface. The recess includes a bottom for carrying a chip thereon. The microphone further includes a transducer spanning the recess. By virtue of this configuration, the size of the microphone is reduced, and acoustic performance of the microphone is accordingly improved.

摘要翻译： 公开了一种硅电容麦克风。 硅电容麦克风包括具有顶表面，与顶表面相对的下表面以及从顶表面向下表面凹陷的凹槽的基底。 凹部包括用于在其上承载芯片的底部。 麦克风还包括跨越凹部的传感器。 凭借这种配置，麦克风的尺寸减小，麦克风的声学性能相应提高。

公开(公告)号：US20150189443A1

公开(公告)日：2015-07-02

申请号：US14284662

申请日：2014-05-22

申请人： Kai Wang ,  Zhijiang Wu

发明人： Kai Wang ,  Zhijiang Wu

IPC分类号： H04R17/02

CPC分类号： H04R19/04 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R19/005 ,  H01L2924/00014

摘要： A silicon condenser microphone is disclosed. The silicon condenser microphone includes a substrate having a top surface, a lower surface opposed to the top surface, and a recess concave from the top surface toward the lower surface. The recess includes a bottom for carrying a transducer unit thereon. The microphone further includes a chip stacked on the transducer. By virtue of this configuration, the size of the microphone is reduced, and acoustic performance of the microphone is accordingly improved.

摘要翻译： 公开了一种硅电容麦克风。 硅电容麦克风包括具有顶表面，与顶表面相对的下表面以及从顶表面向下表面凹陷的凹槽的基底。 凹部包括用于在其上承载换能器单元的底部。 麦克风还包括堆叠在换能器上的芯片。 凭借这种配置，麦克风的尺寸减小，麦克风的声学性能相应提高。

公开(公告)号：US09699538B2

公开(公告)日：2017-07-04

申请号：US14832735

申请日：2015-08-21

申请人： Guojun Liu ,  Peng Zeng ,  Zhijiang Wu

发明人： Guojun Liu ,  Peng Zeng ,  Zhijiang Wu

IPC分类号： H04R1/08 ,  H04R1/04

CPC分类号： H04R1/04 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R2201/003

摘要： A micro-electro-mechanical system (MEMS) microphone device is provided in the present disclosure. The MEMS microphone device includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a metal shielding member disposed between the electronic components and the electromagnetic shielding cover. The electromagnetic shielding cover has an inner surface and an outer surface; and at least one of the inner surface and the outer surface is provided with a first metal shielding layer. At least one of the electromagnetic shielding cover and the metal shielding member is electrically connected to the circuit board.

公开(公告)号：US09510109B2

公开(公告)日：2016-11-29

申请号：US14832590

申请日：2015-08-21

申请人： Guojun Liu ,  Peng Zeng ,  Zhijiang Wu

发明人： Guojun Liu ,  Peng Zeng ,  Zhijiang Wu

IPC分类号： H04R25/00 ,  H04R19/04

CPC分类号： H04R19/04 ,  H04R2201/003 ,  H04R2225/49

摘要： A micro-electro-mechanical system (MEMS) microphone device is provided in the present disclosure. The MEMS microphone device includes a first electromagnetic shielding cover defining a first accommodating space; a second electromagnetic shielding cover received in the first accommodating space and defining a second accommodating space; a MEMS chip and an application specific integrated circuit (ASIC) chip received in the second accommodating space. The first electromagnetic shielding cover and the second electromagnetic shielding cover cooperatively provide dual electromagnetic shielding protection for the MEMS chip and the ASIC chip.

摘要翻译： 在本公开中提供了微机电系统（MEMS）麦克风装置。 MEMS麦克风装置包括限定第一容纳空间的第一电磁屏蔽罩; 第二电磁屏蔽盖，容纳在所述第一容纳空间中并限定第二容纳空间; MEMS芯片和专用集成电路（ASIC）芯片接收在第二容纳空间中。 第一电磁屏蔽罩和第二电磁屏蔽罩协同提供MEMS芯片和ASIC芯片的双电磁屏蔽保护。