公开(公告)号：US20100186479A1

公开(公告)日：2010-07-29

申请号：US12359772

申请日：2009-01-26

申请人： Leonard Borucki ,  Yun Zhuang ,  Yasa Sampurno ,  Ara Philipossian

发明人： Leonard Borucki ,  Yun Zhuang ,  Yasa Sampurno ,  Ara Philipossian

IPC分类号： G01N3/56

CPC分类号： G01N3/56

摘要： The present invention is a method for determining the location of and distinguishing aggressive diamonds from active diamonds on a diamond conditioner disc, comprising: (a) contacting a diamond conditioner disc with a hard surface, wherein the diamond-containing side of the diamond conditioning disc is facing the hard surface, (b) pushing the conditioner disc a sufficient distance that all diamonds could possibly be scratching the surface at the same time and at least a distance corresponding to the length of the said diamond conditioner disc (c) observing number and position of the scratches left by diamonds on the hard surface to determine the number and position of active diamonds on the diamond conditioner disc, and (d) selecting the diamonds, the marks for which are the most pronounced and which comprise 50% or more of the total furrow area observed for all of the active diamonds in descending order of furrow are plus any diamonds in excess of the number needed to achieve said 50% or more whose individual furrow area is 2% or more, which diamonds are determined to be aggressive diamonds, or impressing the diamond conditioner disc under a load onto a hard surface and the impression of the most aggressive diamonds in the hard surface being confirmed by microscopic examination to in turn confirm the position and aggressiveness of the aggressive diamonds observed or (e) contacting a diamond conditioner disc with a hard surface, wherein the diamond-containing side of the diamond conditioning disc is facing the hard surface, (f) pushing the conditioner disc a sufficient distance that all diamonds could possibly be scratching the surface at the same time and at least a distance corresponding to the length of the said diamond conditioner disc (g) observing number and position of the scratches left by diamonds on the hard surface to determine the number and position of active diamonds on the diamond conditioner disc, (h) the hard surface further comprises a layer of contrasting material such that when the diamond conditioner disc moves across the hard surface, the said diamond conditioner disc crosses the limits of the layer entirely from one end to the other and scratches the layer of contrasting material on the hard surface thereby leaving a visible mark, (i) the said layer is between 8 and 15 microns thick and (j) selecting the diamonds which cut entirely through the said layer allowing backlighting to be easily viewed.

公开(公告)号：US20110076924A1

公开(公告)日：2011-03-31

申请号：US12568267

申请日：2009-09-28

申请人： Ara Philipossian ,  Yasa Sampurno ,  Yun Zhuang ,  Sian Theng ,  Fransisca Sudargho

发明人： Ara Philipossian ,  Yasa Sampurno ,  Yun Zhuang ,  Sian Theng ,  Fransisca Sudargho

IPC分类号： B24B49/00

CPC分类号： B24B37/005 ,  B24B37/042 ,  B24B37/20 ,  B24B49/16

摘要： The present invention is a method for obtaining data easily, accurately and effectively that may be used in determination of Sommerfeld Numbers and COF for CMP polishing. Using the Sommerfeld Numbers and COF values thus obtained the lubrication mechanism of CMP polishing with particular materials and under particular conditions can easily and reliably be studied. The method of the present invention is accomplished by use of CMP polishing tools capable of simultaneously measuring shear force and normal force, and rendering a value for the COF while simultaneously enabling the operator to change pressure on and relative velocity of the CMP wafer and CMP polishing pad in real time. Using the said CMP tool, the pressure and relative velocity may be varied separately or together for the desired length of time according to the needs of the operator so that within one CMP process multiple measurements may be taken under the same process conditions.

摘要翻译： 本发明是容易，准确，有效地获得数据的方法，可用于确定CMP抛光的Sommerfeld编号和COF。 使用由此获得的Sommerfeld数和COF值可以容易且可靠地研究特定材料和特定条件下的CMP抛光的润滑机理。 本发明的方法通过使用能够同时测量剪切力和法向力的CMP研磨工具来实现，并且为COF提供一个值，同时使操作者能够改变CMP晶片和CMP抛光的压力和相对速度 垫实时。 使用所述CMP工具，压力和相对速度可以根据操作者的需要而单独地或一起改变所需时间长度，使得在一个CMP过程中可以在相同的工艺条件下进行多次测量。

公开(公告)号：US20080200032A1

公开(公告)日：2008-08-21

申请号：US12033381

申请日：2008-02-19

申请人： Toranosuke ASHIZAWA ,  Masaya NISHIYAMA ,  Ara PHILIPOSSIAN ,  Yun ZHUANG ,  Yasa Adi SAMPURNO ,  Fransisca SUDARGHO

发明人： Toranosuke ASHIZAWA ,  Masaya NISHIYAMA ,  Ara PHILIPOSSIAN ,  Yun ZHUANG ,  Yasa Adi SAMPURNO ,  Fransisca SUDARGHO

IPC分类号： H01L21/302

CPC分类号： H01L21/31053 ,  B24B37/013 ,  B24B37/042 ,  B24B49/16 ,  H01L22/26

摘要： The present invention relates to a method of polishing a semiconductor substrate, comprising pressing a semiconductor substrate having a film to be polished that is held by a carrier onto a polishing cloth fixed on a revolving polishing table and supplying a polishing slurry to the space between the polishing cloth and the semiconductor substrate, wherein the end point of polishing is determined according to the change in the friction coefficient while the friction coefficient between the semiconductor substrate and the polishing cloth is measured. According to the present invention it is possible to measure friction coefficient accurately in polishing a semiconductor substrate and use the change thereof to determine the end point of polishing.

摘要翻译： 本发明涉及一种抛光半导体衬底的方法，包括将具有由载体保持的待抛光膜的半导体衬底压在固定在旋转抛光台上的抛光布上，并将抛光浆料供应到 抛光布和半导体基板，其中在测量半导体基板和抛光布之间的摩擦系数的同时，根据摩擦系数的变化来确定抛光的终点。 根据本发明，可以在研磨半导体衬底时精确地测量摩擦系数，并使用其变化来确定抛光的终点。

公开(公告)号：US20100203811A1

公开(公告)日：2010-08-12

申请号：US12367881

申请日：2009-02-09

申请人： Ara Philipossian ,  Yasa Sampurno ,  Yun Zhuang

发明人： Ara Philipossian ,  Yasa Sampurno ,  Yun Zhuang

IPC分类号： B24B7/00 ,  B24B55/00

CPC分类号： B24B53/017 ,  B24B37/042

摘要： The present invention is a method and apparatus for accelerated pulling and fracturing of aggressive diamonds on a CMP diamond conditioner disc wherein aggressive diamonds of known position are pulled or fractured by contacting the diamond conditioner disc to a plate or sheet of a hard material or a plate or sheet containing discrete structures of hard material relative to which the diamond disc is in motion at a determinable and reproducible rate for a determinable and reproducible period of time and the number and position of the pulled or fractured aggressive diamonds are determined following the completion of said contact.

摘要翻译： 本发明是一种用于在CMP金刚石矫正器盘上加速拉伸和压裂侵蚀性钻石的方法和装置，其中已知位置的侵蚀性金刚石通过将金刚石调节盘接触到硬质材料或板材的板或片材而被拉断或断裂 或包含硬质材料的离散结构的片材，相对于该硬质材料，金刚石圆盘以可确定和可再现的速率运动，以确定可重复的时间段，并且在完成所述的时间之后确定拉出的或断裂的侵略性钻石的数量和位置 联系。

公开(公告)号：US20100107726A1

公开(公告)日：2010-05-06

申请号：US12262974

申请日：2008-10-31

申请人： Leonard Borucki ,  Naoki Rikita ,  Ara Philipossian ,  Fransisca Maria Astrid Sudargho ,  Yun Zhuang

发明人： Leonard Borucki ,  Naoki Rikita ,  Ara Philipossian ,  Fransisca Maria Astrid Sudargho ,  Yun Zhuang

IPC分类号： G01N19/02

CPC分类号： B24B53/12 ,  B24B49/16

摘要： A device for determining the coefficient of friction of diamond conditioner discs and a method of use thereof. The device is a solid base means comprising a block of granite with a smooth flat upper surface, a diamond conditioner disc counter surface means comprising a removable sheet of polycarbonate, a means for moving the diamond conditioner disc comprising an assembly parallel to and perpendicular to the surface of the said slab and overlain material along which a plate, the surface of which is parallel to the surface of the assembly and perpendicular to the surface of the said slab and overlain material, is moved by a screw, a means for securing the diamond conditioner disc comprising a holder bolted to the said plate that is capable of riding just above the surface of the slab and overlain material with an anterior face with respect to the direction of motion that is concave and capable of securely holding a diamond conditioner disc placed grinding face down upon the said overlain material the top of which is open so that load may be applied to the diamond conditioner disc and a means for measuring the shear force imparted by the moving diamond conditioner disc comprising a load cell. Shear force and down force are determined using the above apparatus and the coefficient of friction of the diamond conditioner disc and the said sheet are calculated therefrom.

摘要翻译： 一种用于确定金刚石修整片的摩擦系数的装置及其使用方法。 该装置是一种固体基部装置，包括具有光滑平坦上表面的花岗岩块，金刚石调节盘对置表面装置，包括可移除的聚碳酸酯片，用于移动金刚石调节盘的装置，其包括平行于并垂直于 所述板坯和覆盖材料的表面，其表面平行于组件的表面并且垂直于所述板坯和覆盖材料的表面沿着该板的表面通过螺钉移动，用于固定金刚石的装置 调节盘包括螺栓连接到所述板的支架，其能够刚好在板的表面上方并且相对于凹入的运动方向的前表面覆盖材料，并且能够可靠地保持钻石调节盘放置研磨 面朝下地覆盖所述重叠的材料，其顶部是敞开的，从而可以将负载施加到钻石调节盘和用于的钻石调节盘 测量包括测力传感器的移动金刚石调节盘所施加的剪切力。 使用上述装置确定剪切力和向下力，并由此计算金刚石调节盘和所述片材的摩擦系数。