公开(公告)号：US20090197113A1

公开(公告)日：2009-08-06

申请号：US12229233

申请日：2008-08-20

申请人： Yu-Tsung Wu ,  Jen-Hong Huang ,  Chung-Min Tsai ,  Huan-Chieh Su ,  Tri-Rung Yew

发明人： Yu-Tsung Wu ,  Jen-Hong Huang ,  Chung-Min Tsai ,  Huan-Chieh Su ,  Tri-Rung Yew

IPC分类号： H01L21/70

CPC分类号： H01L21/76823 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  Y10T428/12625 ,  Y10T428/24851 ,  H01L2924/00

摘要： A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and the interfacial metallic layer. A conductive carbon line or plug is formed in the amorphous carbon or carbon-based insulating layer electrically connected with the interfacial metallic layer. An interconnect structure is also described, including a substrate, a patterned interfacial metallic layer on the substrate, an amorphous carbon insulating layer or a carbon-based insulating layer on the substrate, and a conductive carbon line or plug disposed in the amorphous carbon or carbon-based insulating layer and electrically connected with the interfacial metallic layer.

摘要翻译： 描述制造互连结构的方法。 提供基板。 在基板上形成有图案的界面金属层。 形成覆盖基板和界面金属层的无定形碳绝缘层或碳基绝缘层。 在与界面金属层电连接的无定形碳或碳基绝缘层中形成导电碳线或插塞。 还描述了一种互连结构，包括衬底，衬底上的图案化界面金属层，衬底上的无定形碳绝缘层或碳基绝缘层，以及设置在无定形碳或碳中的导电碳线或插塞 的绝缘层，并与界面金属层电连接。

公开(公告)号：US07858147B2

公开(公告)日：2010-12-28

申请号：US12229233

申请日：2008-08-20

申请人： Yu-Tsung Wu ,  Jen-Hong Huang ,  Chung-Min Tsai ,  Huan-Chieh Su ,  Tri-Rung Yew

发明人： Yu-Tsung Wu ,  Jen-Hong Huang ,  Chung-Min Tsai ,  Huan-Chieh Su ,  Tri-Rung Yew

IPC分类号： B05D5/12 ,  C23C16/00 ,  B05D3/00 ,  C23C14/00

CPC分类号： H01L21/76823 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  Y10T428/12625 ,  Y10T428/24851 ,  H01L2924/00

摘要： A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and the interfacial metallic layer. A conductive carbon line or plug is formed in the amorphous carbon or carbon-based insulating layer electrically connected with the interfacial metallic layer. An interconnect structure is also described, including a substrate, a patterned interfacial metallic layer on the substrate, an amorphous carbon insulating layer or a carbon-based insulating layer on the substrate, and a conductive carbon line or plug disposed in the amorphous carbon or carbon-based insulating layer and electrically connected with the interfacial metallic layer.

摘要翻译： 描述制造互连结构的方法。 提供基板。 在基板上形成有图案的界面金属层。 形成覆盖基板和界面金属层的无定形碳绝缘层或碳基绝缘层。 在与界面金属层电连接的无定形碳或碳基绝缘层中形成导电碳线或插塞。 还描述了一种互连结构，包括衬底，衬底上的图案化界面金属层，衬底上的无定形碳绝缘层或碳基绝缘层，以及设置在无定形碳或碳中的导电碳线或插塞 的绝缘层，并与界面金属层电连接。