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1.发明授权Loading device of chemical mechanical polishing equipment for semiconductor wafers 有权半导体晶圆化学机械抛光设备装载装置公开(公告)号：US07892069B2
公开(公告)日：2011-02-22
申请号：US12088751
申请日：2006-07-21
申请人： Young Min Na , Chang Il Kim , Young Su Heo
发明人： Young Min Na , Chang Il Kim , Young Su Heo
IPC分类号： B24B49/00
CPC分类号： B24B37/345
摘要： A loading device of chemical mechanical polishing (CMP) equipment for processing semiconductor wafers is provided. The loading device includes a loading cup having a cup-like bath, a cup plate installed in the bath, and a loading plate supported on the cup plate for absorbing shock and seating the wafer. A driving device and a driving shaft horizontally pivot and vertically move the loading cup between a platen of a polishing apparatus and a spindle. An arm connects the loading cup and the driving shaft. At least one through hole is located in a mutually corresponding position of the bath, the cup plate, and the loading plate of the loading cup. A probe assembly optically detects a polished thickness at a polished point on the wafer.
摘要翻译： 提供了用于处理半导体晶片的化学机械抛光（CMP）设备的装载装置。 装载装置包括具有杯形浴的装载杯，安装在浴中的杯板，以及支撑在杯板上用于吸收冲击和安放晶片的装载板。 驱动装置和驱动轴水平地枢转并且将加载杯垂直移动在抛光装置的压板和主轴之间。 手臂连接装载杯和驱动轴。 至少一个通孔位于浴槽，杯板和装载杯的装载板的相应对应位置。 探针组件在晶片的抛光点处光学地检测抛光的厚度。
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2.发明申请Loading Device of Chemical Mechanical Polishing Equipment for Semiconductor Wafers 有权半导体晶片化学机械抛光设备的装载装置公开(公告)号：US20090130955A1
公开(公告)日：2009-05-21
申请号：US12088751
申请日：2006-07-21
申请人： Young Min Na , Chang Il Kim , Young Su Heo
发明人： Young Min Na , Chang Il Kim , Young Su Heo
CPC分类号： B24B37/345
摘要： A loading device of chemical mechanical polishing (CMP) equipment for processing semiconductor wafers is provided. The loading device includes a loading cup having a cup-like bath, a cup plate installed in the bath, and a loading plate supported on the cup plate for absorbing shock and seating the wafer. A driving device and a driving shaft horizontally pivot and vertically move the loading cup between a platen of a polishing apparatus and a spindle. An arm connects the loading cup and the driving shaft. At least one through hole is located in a mutually corresponding position of the bath, the cup plate, and the loading plate of the loading cup. A probe assembly optically detects a polished thickness at a polished point on the wafer.
摘要翻译： 提供了用于处理半导体晶片的化学机械抛光（CMP）设备的装载装置。 装载装置包括具有杯形浴的装载杯，安装在浴中的杯板，以及支撑在杯板上用于吸收冲击和安放晶片的装载板。 驱动装置和驱动轴水平地枢转并且将加载杯垂直移动在抛光装置的压板和主轴之间。 手臂连接装载杯和驱动轴。 至少一个通孔位于浴槽，杯板和装载杯的装载板的相应对应位置。 探针组件在晶片的抛光点处光学地检测抛光的厚度。
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