摘要:
A dual pipe according to present invention includes an outer pipe having a valley/ridge portion on an outer circumferential surface thereof, and an inner pipe having a valley/ridge portion formed on an inner circumferential surface thereof and inserted into the outer pipe. In the dual pipe, the inner pipe and the outer pipe are threadedly engaged with each other. A low pressure refrigerant passes through the inner pipe. In order to secure a passage of a high pressure refrigerant in a space between the outer circumferential surface of the inner pipe and the inner circumferential surface of the outer pipe, a part of the helical valley/ridge portion formed on the outer circumferential surface of the inner pipe is composed of a multiple-helix helical valley/ridge portion. A part of the helical valley/ridge portion formed on the inner circumferential surface of the outer pipe is composed of a single-helix helical valley/ridge portion (more precisely, a helical valley/ridge portion having a smaller number of helixes than the number of helixes of the multiple-helix helical valley/ridge portion of the inner pipe). That is, the high-pressure refrigerant flows through a space between a valley of a non-threadedly-engaged helical valley/ridge portion of the multiple-helix helical valley/ridge portion, which is formed on the outer circumferential surface of the inner pipe, and the outer pipe.
摘要:
Disclosed is a method of processing an S-parameter to analyze transient phenomena in a passive network, the method including: generating an extrapolation function related to a real part of a measured S-parameter signal; generating an expanded S-parameter signal by the extrapolation function; and setting an optimum degree and an optimum expansion frequency of the expanded S-parameter signal. Thus, the extrapolation function where continuity from the real part of the measured S-parameter signal is ensured is used such that causality in an impulse response of the expanded S-parameter signal can be maintained without problems.
摘要:
An electrode for a fuel cell is disclosed. The electrode may include an electrode substrate with a conductive substrate, carbon particles, and a catalyst layer disposed on the electrode substrate. The electrode substrate may include a pore having an average diameter of about 20 μm to about 40 μm and porosity of about 30 volume % to about 80 volume % based on the total volume of the electrode substrate. A membrane-electrode assembly including the electrode and a fuel cell system including the membrane electrode assembly are also disclosed.
摘要:
A product authentication label includes a carrier layer made of a transparent or translucent material, a plurality of first reflection pattern forming bodies disposed in the carrier layer and configured to reflect a substantially identical reflection pattern regardless of the direction of irradiated light, and a plurality of second reflection pattern forming bodies randomly disposed in the carrier layer and configured to reflect a reflection pattern which varies depending on the direction of irradiated light.
摘要:
Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.
摘要:
Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same.
摘要:
The present invention relates to a portable boiler for a hot mat, which comprises: a water reservoir, one side of which has an inlet pipe for introducing water circulating through the hot mat, and which stores the water; a heat transfer unit in which the water discharged from the water reservoir flows along a flow channel pipe to be heat exchanged, wherein the water is discharged to the hot mat via an outlet pipe formed at one side thereof; a heating unit which burns the fuel gas fed from a fuel tank to heat the water in the heat transfer unit; and a housing which forms the outer appearance of the boiler.
摘要:
The present invention relates to a design support system for financial products of a divisional payment type (FPD). A plurality of computing modules according to the present invention are systematically disposed within a communication pipeline of an FPD sales staff's communication terminal which is connected to an online network so that the FPD sales staff can provide FPD design particulars corresponding to desires of customers whom the FPD sales staff is handling without any particular difficulties in real time using the modules. Accordingly, it is possible to guide the FPD sales staff and an FPD management company, and furthermore, each customer can easily avoid problems related to reduction in business efficiency or sales efficiency of the FPD, and the inability to rapidly invest in and possess desired FPD, and the like.
摘要:
Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same.
摘要:
A positive photosensitive resin composition according to one embodiment of the present invention includes a polyamic acid or a polyamic acid ester compound including a repeating unit represented by Formula 1 defined in this specification, a photosensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The positive photosensitive resin composition can be cured at a low temperature of 260° C. or less, and can have high sensitivity, resolution, residue removal, substrate adherence, and pattern-forming capabilities, and low film shrinkage.