Abstract:
A programmable system includes a first level protection circuit comprised of discharge tube CR1/CR2 and piezoresistor MOV1/MOV2 in series; a second-level protection circuit comprised of the series arm of capacitor C1 and resistor R1 in parallel with a transient voltage suppression diode TVS1, and inductors L1/L2 connected to the ends of first level and second-level protection circuits respectively. A control circuit includes a PWM driver module and a SCM. The PWM driver module is connected to the PWM control port of the SCM and its output is connected to an IGBT module. The control circuit is also connected to a series communication module and to a user interface. The features of the invention are: strong-shock resistance; a wide range of load adaptability; and ability of accurately and steplessly regulating and adjusting with high frequency and high power load.
Abstract:
Circuits, methods, and apparatus for dynamic control of source and termination impedances. One output stage provides a series termination when transmitting and a parallel termination when receiving data. A pull-up device has a nominal impedance of 50 ohms when the output stage pulls a pin from a low voltage to a high voltage, while a pull-down device has a nominal impedance of 50 ohms when the pin is pulled from a high voltage to a low voltage. Both the pull-up and pull-down devices are turned on when receiving data. Due to their non-linear current-voltage characteristics, the pull-up device appears as 50 ohms when the pin voltage is higher than one half the supply voltage, while the pull-down device appears as 50 ohms when the pin voltage is lower than one half the supply voltage. The pull-up and pull-down devices can be calibrated to provide a nominal 50 ohm impedance.
Abstract:
An adjustable delay circuit includes first and second transistors each having a control input coupled to an input node of the adjustable delay circuit and an output coupled to an output node of the adjustable delay circuit. The adjustable delay circuit includes a first pass gate coupled between first and second capacitors and the output node of the adjustable delay circuit. The first and the second capacitors are coupled between a node at a high voltage and a node at a low voltage. The first pass gate is operable to be controlled by a first delay control signal.
Abstract:
A dynamic phase alignment circuit includes a phase generator circuit having delay-locked loop circuits that generate periodic output signals. Each of the delay-locked loop circuits generates one of the periodic output signals in response to at least two periodic input signals. A multiplexer circuit selects a selected periodic signal from among the periodic input signals and the periodic output signals based on select signals. A phase detection circuit compares a phase of the selected periodic signal to a data signal to generate a phase detection signal. A control logic circuit generates the select signals. The control logic circuit adjusts the select signals based on changes in the phase detection signal to cause the multiplexer circuit to adjust the phase of the selected periodic signal.
Abstract:
Circuits, methods, and apparatus for dynamic control of source and termination impedances. One output stage provides a series termination when transmitting and a parallel termination when receiving data. A pull-up device has a nominal impedance of 50 ohms when the output stage pulls a pin from a low voltage to a high voltage, while a pull-down device has a nominal impedance of 50 ohms when the pin is pulled from a high voltage to a low voltage. Both the pull-up and pull-down devices are turned on when receiving data. Due to their non-linear current-voltage characteristics, the pull-up device appears as 50 ohms when the pin voltage is higher than one half the supply voltage, while the pull-down device appears as 50 ohms when the pin voltage is lower than one half the supply voltage. The pull-up and pull-down devices can be calibrated to provide a nominal 50 ohm impedance.
Abstract:
On-chip termination (OCT)calibration techniques are provided that support input/output (IO) banks on an integrated circuit (IC) using OCT controllers. The OCT controllers calibrate the on-chip termination impedance in the IO banks using a shared parallel bus or separate parallel buses. Multiplexers or select logic in each IO bank select control signals from the OCT controllers in response to select signals. According to some embodiments, each of the IO banks on an IC can receive OCT control signals from any of the OCT controllers on the IC.
Abstract:
Techniques are provided for controlling an on-chip termination resistance in an input or output (IO) buffer using calibration circuits. Each calibration circuit monitors the voltage between an external resistor and a group of on-chip transistors. When the effective resistance of the group of transistors matches the external resistance, the calibration circuit causes the effective resistance of drive transistors in the IO buffer to match the effective resistance of the group of on-chip transistors.
Abstract:
An input buffer circuit has a plurality of selectively enabled differential amplifier circuits, where each differential amplifier is configured for compatibility with a particular differential I/O standard and its corresponding input operating range. For example, the input buffer may have two differential amplifiers suitable for receiving LVDS differential input signals over a wide input operating range, and another differential amplifier suitable for receiving the PCML differential input signals. One or more control signals are provided to the input buffer, e.g., programmably, to selectively enable the required differential amplifier(s) for a given I/O standard.
Abstract:
Circuits, methods, and apparatus for protecting devices in an output stage from over-voltage conditions caused by high supply and input voltages. Embodiments provide over-voltage protection that operates over a range of voltage levels, and that can be optimized for performance at different voltage levels. An exemplary embodiment of the present invention uses stacked devices to protect n and p-channel output devices from excess supply and input voltages. These stacked devices are biased by voltages received at their gates. These gate voltages vary as a function of supply voltage to maintain performance. Other embodiments of the present invention provide a body bias switch that generates a bias for the bulk of p-channel output devices. This bias tracks the higher of a supply or input voltage, such that parasitic drain-to-bulk diodes do not conduct. A switch may be provided that shorts the bulk connection to VCC under appropriate conditions.
Abstract:
A programmable I/O element for an I/O terminal of a logic array is suitable for operating according to high speed 110 modes such as double data rate and zero bus turnaround. The I/O element may include an input block with two registers for registering input signals from the terminal upon alternate clock edges. In addition or alternatively, it may include an output block with two registers that separately register output signals from the array on the same clock edge and a multiplexer that alternately outputs those signals. For bidirectional terminals, the multiplexer output is connectable to the I/O terminal via an output buffer, and an output enable block provides an enable signal to a gating input of the output buffer. Programmable delays may be included in the input, output, and output enable paths, in particular to provide a slower turn-on time than turn-off time for the output buffer.