公开(公告)号：US07654436B2

公开(公告)日：2010-02-02

申请号：US11858505

申请日：2007-09-20

申请人： Wing Cheung James Ho ,  Hon Shing Eddie Law ,  Kam Hong Kenneth Lam ,  Wai Lok Ben To

发明人： Wing Cheung James Ho ,  Hon Shing Eddie Law ,  Kam Hong Kenneth Lam ,  Wai Lok Ben To

IPC分类号： B23K31/02

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78801 ,  H01L2224/85121 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.

摘要翻译： 一种引线接合装置和方法，其中提供单独的第一和第二定位台用于安装待接线的电子设备，并且在用于接合电子设备的接合位置处提供接合工具。 提供第一和第二装载/卸载位置用于将电子装置从定位台装载或卸载电子装置。 第一和第二定位台可操作以彼此独立地移动，使得第一定位台可在第一装载/卸载位置和结合位置之间移动，并且第二定位台可在第二装载/卸载位置与 粘接位置。

公开(公告)号：US20090078743A1

公开(公告)日：2009-03-26

申请号：US11858505

申请日：2007-09-20

申请人： Wing Cheung James HO ,  Hon Shing Eddie LAW ,  Kam Hong Kenneth LAM ,  Wai Lok Ben TO

发明人： Wing Cheung James HO ,  Hon Shing Eddie LAW ,  Kam Hong Kenneth LAM ,  Wai Lok Ben TO

IPC分类号： B23K31/00 ,  B23K37/00 ,  B23K37/04

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78801 ,  H01L2224/85121 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.

摘要翻译： 一种引线接合装置和方法，其中提供单独的第一和第二定位台用于安装待接线的电子设备，并且在用于接合电子设备的接合位置处提供接合工具。 提供第一和第二装载/卸载位置用于将电子装置从定位台装载或卸载电子装置。 第一和第二定位台可操作以彼此独立地移动，使得第一定位台可在第一装载/卸载位置和结合位置之间移动，并且第二定位台可在第二装载/卸载位置与 粘接位置。