公开(公告)号：US06342166B1

公开(公告)日：2002-01-29

申请号：US09454530

申请日：1999-12-06

Applicant: Satoru Ide ,  Kiyoshi Tanaka ,  Toshihiro Itho

Inventor： Satoru Ide ,  Kiyoshi Tanaka ,  Toshihiro Itho

IPC: H01L21302

CPC classification number: B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  H01L21/31053

Abstract: A method of detecting an end point of polishing of a wafer, comprising the steps of: using a color identifying sensor for recognizing a color component of light by applying light from a light source and by converging reflected light to an optical fiber to cause the color identifying sensor to previously recognize a color component of a substance of a wafer which must be polished; displaying an ON-state when the color component is recognized and an OFF-state when the color component is not recognized; one point (except for the central point) of the surface of the rotating wafer is irradiated with light emitted from the color identifying sensor to cause the color identifying sensor to detect the number of times (m) of off-states; and determining an end of polishing of the wafer when the detected number of times (m) coincides with the number (n) of off-states indicating an optimum end point of polishing of the wafer.

Abstract translation: 一种检测晶片抛光终点的方法，包括以下步骤：使用颜色识别传感器，用于通过施加来自光源的光来识别光的颜色分量，并且通过将反射光聚焦到光纤以使颜色 识别传感器以预先识别必须抛光的晶片的物质的颜色分量; 当识别颜色分量时显示ON状态，并且当颜色分量不被识别时显示OFF状态; 用从颜色识别传感器发出的光照射旋转晶片的表面的一个点（中心点除外），以使颜色识别传感器检测关闭状态的次数（m）; 并且当检测到的次数（m）与表示晶片的最佳抛光终点的关闭状态的数量（n）一致时，确定晶片的抛光结束。