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公开(公告)号：US20250065377A1
公开(公告)日：2025-02-27
申请号：US18283167
申请日：2021-12-14
Applicant: TOKYO SEIMITSU CO., LTD.
Inventor： Junichi FUKUSHIMA
Abstract: A cleaning device for a wafer-suction chuck mechanism capable of automatically and simply performing cleaning treatment on a chuck surface that suction-holds a wafer and cleaning treatment on a frame suction-holding section. The cleaning device is configured to include a scraper 17 and a brush 18 that press frame suction-holding section cleaning means 10B for removing a sludge on a frame suction-holding section 11B onto the frame suction-holding section 11B, and a water nozzle 19 that discharges and supplies water onto the frame suction-holding section 11B.
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公开(公告)号：US20250018501A1
公开(公告)日：2025-01-16
申请号：US18898920
申请日：2024-09-27
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Chikara AIKAWA , Takashi MORIMOTO , Hirokazu HAYASHI
IPC: B23K26/04 , B23K26/03 , B23K26/06 , B23K26/073
Abstract: Provided are a method and a device for adjusting an optical axis of laser light, capable of accurately grasping change in the state of the laser light and maintaining the quality of laser processing. The method for adjusting an optical axis of laser light includes: a step of detecting a position of laser light by position sensitive detectors arranged at two or more detection positions on an optical path of the laser light that is output from a laser light source toward a workpiece; and a step of adjusting, based on the detected position of the laser light, at least one of a position and an angle of optical elements arranged at two or more positions on the optical path of the laser light, to adjust an optical axis of the laser light.
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公开(公告)号：US20240404847A1
公开(公告)日：2024-12-05
申请号：US18694754
申请日：2022-05-24
Applicant: TOKYO SEIMITSU CO., LTD.
Inventor： Hitoshi AOKI , Kiyotaka KIZAKI , Yuki MORITA , Ryosuke SUMIYA
IPC: H01L21/67 , H01L21/683
Abstract: A sheet release apparatus that stably releases a protective sheet from an adherend without damaging the adherend. A sheet release apparatus includes a conveyance table that is movable in a predetermined movement direction with an adherend held therein and a heat stamp that bonds a release tape to a protective sheet, in which the heat stamp includes a plurality of stamp heads that each contact the release tape to press the release tape toward the protective sheet.
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公开(公告)号：US20240393104A1
公开(公告)日：2024-11-28
申请号：US18795866
申请日：2024-08-06
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Yoshiyuki KAWATA , Katsufumi MORIYAMA , Hideki MORII
IPC: G01B11/24 , G01D5/347 , H04N23/695
Abstract: A surface shape measuring device includes a camera that captures the observation image acquired by the optical head, a drive unit that causes the optical head to scan relatively in a scanning direction perpendicular to the measurement target, an encoder for detecting a position of the optical head in the scanning direction with respect to the measurement target, an imaging instructing unit that instructs the camera to capture the observation image based on a position signal output from the encoder for each predetermined interval, a frame dropping occurrence rate calculating unit that calculates a frame dropping occurrence rate indicating an occurrence rate of frame dropping of the camera, and a measurement condition setting unit that sets a measurement condition for measuring a surface shape of the measurement target based on the frame dropping occurrence rate.
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公开(公告)号：US20240375230A1
公开(公告)日：2024-11-14
申请号：US17642189
申请日：2021-04-14
Applicant: TOKYO SEIMITSU CO., LTD.
Inventor： Kazumasa ISHIKAWA
Abstract: A fly-cut apparatus to process a work with bumps on a front surface. A fly-cut apparatus cuts an upper surface of a BG film laminated to a work including a bump region with bumps formed on a front surface and an outer peripheral region around the bump region. The fly-cut apparatus includes a fly-cut tool, a tool spindle with a lower end to which the fly-cut tool is attached, and capable of ascending and descending in a state of rotating the fly-cut tool, and a chuck which rotatably retains the work, and the fly-cut tool cuts the upper surface of the BG film from a center toward an outer perimeter.
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Patent Agency Ranking
公开(公告)号：US20240329617A1
公开(公告)日：2024-10-03
申请号：US18622329
申请日：2024-03-29
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Hiroya SHINOHARA , Tasuku SHIMIZU
IPC: G05B19/406 , G05B13/02
CPC classification number: G05B19/406 , G05B13/0265
Abstract: A machining state detection apparatus acquires an environmental temperature history, a blade supply water temperature history, and a heat source supply water temperature history, and derives an environmental temperature history feature amount, a blade supply water temperature history feature amount, and a heat source supply water temperature history feature amount, and when a machining error is predicted based on a temperature history feature amount including the environmental temperature history feature amount, the blade supply water temperature history feature amount and the heat source supply water temperature history feature amount, with a learning model which is trained using the temperature history feature amount and the machining error as learning data and which outputs a prediction value of the machining error, when the temperature history feature amount is input.
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公开(公告)号：US20240319263A1
公开(公告)日：2024-09-26
申请号：US18583858
申请日：2024-02-22
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Eiji FUKANO
CPC classification number: G01R31/2887 , G01R31/2853 , H01L22/14 , H01L22/20
Abstract: A drive control device including an operation instruction transmission unit configured to transmit an operation instruction to a motor driving device for operating a movement mechanism of a wafer chuck; an information acquisition unit (62) configured to acquire a position deviation information including a position deviation at an actual position of the wafer chuck with respect to a position of the wafer chuck in the operation instruction; an analysis unit (64) configured to analyze the position deviation information; and a determination unit configured to determine an existence or absence of an occurrence of an abnormal operation of the movement mechanism based on an analysis result of the position deviation information can suppress a breakage of the wafer or the like in a state that the wafer and a probe are in contact with each other.
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公开(公告)号：US20240181589A1
公开(公告)日：2024-06-06
申请号：US18282534
申请日：2021-12-07
Applicant: TOKYO SEIMITSU CO,. LTD.
Inventor： Hajime AKAHORI
Abstract: A processing system capable of processing a workpiece with high accuracy. A tilting device capable of tilting a rotation axis 3a of a chuck 3 holds a workpiece W. A film thickness measurement device 7 measures a film thickness of the workpiece W after fine grinding in a non-contact manner. A control device 8 operates a shape of the workpiece W after fine grinding on the basis of a measurement value of the film thickness measurement device 7, calculates a tilt angle of the tilting device such that a difference between a maximum thickness and a minimum thickness of the workpiece W after the fine grinding decreases, and tilts the chuck 3 by the tilt angle such that the workpiece W after the fine grinding is reprocessed by rough grinding, intermediate grinding, and fine grinding in this order with the chuck 3 tilted by the tilt angle.
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公开(公告)号：US20240077304A1
公开(公告)日：2024-03-07
申请号：US18446534
申请日：2023-08-09
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Tasuku SHIMIZU
IPC: G01B11/24 , G01B9/02055
CPC classification number: G01B11/2441 , G01B9/02055
Abstract: The alignment method includes detecting an extending direction of a groove formed on a wafer, based on an image of the wafer picked up by a camera, and performing alignment so as to adjust the extending direction of the groove to be parallel to an array direction of pixels of the camera by relatively rotating the wafer and the camera.
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公开(公告)号：US11656068B2
公开(公告)日：2023-05-23
申请号：US17872820
申请日：2022-07-25
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Kosuke Tomita , Ryo Takanashi
Abstract: A workpiece diameter measurement method includes: detecting positions of a probe while relatively rotating an uncalibrated standard and a detector around a rotation center in a state where the probe is in contact with a circumferential face of the standard from one side in a displacement direction of the probe, detecting the positions of the probe while relatively rotating the standard and the detector around the rotation center in a state where the probe is in contact with the circumferential face from another side in the displacement direction, calculating the position of the rotation center based on the detected positions, relatively rotating a workpiece and the detector around the rotation center in a state where the probe is in contact with the workpiece from the other side, and calculating a diameter of a circumferential face of the workpiece.
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