公开(公告)号：US20110278348A1

公开(公告)日：2011-11-17

申请号：US13146193

申请日：2010-01-26

申请人： Takashi Sugihara ,  Takashi Usuba ,  Hirokazu Ichikawa ,  Toshihiko Mutsuji

发明人： Takashi Sugihara ,  Takashi Usuba ,  Hirokazu Ichikawa ,  Toshihiko Mutsuji

IPC分类号： B23K37/04 ,  B23K3/04 ,  B65G17/20 ,  B23K3/06

CPC分类号： B23K1/0016 ,  B23K1/085 ,  B23K3/08 ,  B23K2101/42 ,  B65G37/005 ,  H05K3/3468

摘要： To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion.Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B. This enables the printed circuit board W1 to be fixed on the predetermined position and to be conveyed to the heater part 4 and the solder bath 5.

摘要翻译： 为了使电路板固定在预定位置并被输送到焊料处理部分。 将印刷电路板W1保持在其间的输送钩10，输送链条15a，15b，其驱动使得输送钩10能够从加热器部分4移动到焊料槽5;第一框架9A，其引导输送链条15a，15b沿着 加热器部分4，沿着焊料槽5引导输送链条15的第二框架9B和设置在每个第一框架9A和每个第二框架9B之间的吸收构件124，其基于 提供了框架9A，9B和输送链15a，15b之间的任何热膨胀差异。 由于吸收构件124基于框架9A，9B和输送链15a，15b之间的任何热膨胀的差异而吸收膨胀和收缩，因此可以防止输送链15a，15b从框架9A， 9B。 这使得印刷电路板W1能够固定在预定位置并被传送到加热器部分4和焊料槽5。

公开(公告)号：US08186563B2

公开(公告)日：2012-05-29

申请号：US13146193

申请日：2010-01-26

申请人： Takashi Sugihara ,  Takashi Usuba ,  Hirokazu Ichikawa ,  Toshihiko Mutsuji

发明人： Takashi Sugihara ,  Takashi Usuba ,  Hirokazu Ichikawa ,  Toshihiko Mutsuji

IPC分类号： B23K37/04

CPC分类号： B23K1/0016 ,  B23K1/085 ,  B23K3/08 ,  B23K2101/42 ,  B65G37/005 ,  H05K3/3468

摘要： To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion.Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B. This enables the printed circuit board W1 to be fixed on the predetermined position and to be conveyed to the heater part 4 and the solder bath 5.

摘要翻译： 为了使电路板固定在预定位置并被输送到焊料处理部分。 将印刷电路板W1保持在其间的输送钩10，输送链条15a，15b，其驱动使得输送钩10能够从加热器部分4移动到焊料槽5;第一框架9A，其引导输送链条15a，15b沿着 加热器部分4，沿着焊料槽5引导输送链条15的第二框架9B和设置在每个第一框架9A和每个第二框架9B之间的吸收构件124，其基于 提供了框架9A，9B和输送链15a，15b之间的任何热膨胀差异。 由于吸收构件124基于框架9A，9B和输送链15a，15b之间的任何热膨胀的差异而吸收膨胀和收缩，因此可以防止输送链15a，15b从框架9A， 9B。 这使得印刷电路板W1能够固定在预定位置并被传送到加热器部分4和焊料槽5。