发明授权
- 专利标题: Automatic soldering device and carrier device
- 专利标题(中): 自动焊接装置和载体装置
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申请号: US13146193申请日: 2010-01-26
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公开(公告)号: US08186563B2公开(公告)日: 2012-05-29
- 发明人: Takashi Sugihara , Takashi Usuba , Hirokazu Ichikawa , Toshihiko Mutsuji
- 申请人: Takashi Sugihara , Takashi Usuba , Hirokazu Ichikawa , Toshihiko Mutsuji
- 申请人地址: JP Tokyo
- 专利权人: Senju Metal Industry Co., Ltd.
- 当前专利权人: Senju Metal Industry Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Chernoff, Vilhauer, McClung & Stenzel
- 优先权: JP2009-015868 20090127
- 国际申请: PCT/JP2010/050982 WO 20100126
- 国际公布: WO2010/087342 WO 20100805
- 主分类号: B23K37/04
- IPC分类号: B23K37/04
摘要:
To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion.Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B. This enables the printed circuit board W1 to be fixed on the predetermined position and to be conveyed to the heater part 4 and the solder bath 5.
公开/授权文献
- US20110278348A1 AUTOMATIC SOLDERING DEVICE AND CARRIER DEVICE 公开/授权日:2011-11-17
信息查询
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