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公开(公告)号：US07737515B2
公开(公告)日：2010-06-15
申请号：US12142897
申请日：2008-06-20
Applicant: Nuggehalli M. Ravindra , Vijay Kasisomayajula , Sudhakar Shet , Anthony T. Fiory
Inventor： Nuggehalli M. Ravindra , Vijay Kasisomayajula , Sudhakar Shet , Anthony T. Fiory
CPC classification number: H01L21/2007 , H01L24/95 , H01L2224/83192 , H01L2224/95092 , H01L2224/95136 , H01L2224/95144 , H01L2924/01004 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/10253 , H01L2924/10272 , H01L2924/10329 , H01L2924/13091 , H01L2924/14 , H01L2924/1423 , H01L2924/1461 , H01L2924/351 , H01L2924/00
Abstract: Systems and methods for assembling a structure onto a substrate include an array of programmable magnets disposed beneath a substrate, wherein a magnetic field is applied to the structure to levitate the structure above the substrate while the structure is moved relative to the substrate to align the structure with a corresponding recess formed in the substrate. A magnetic field may be applied to translate and rotate the structure relative to the substrate. Differences between or among the programmable magnets regarding magnetic polarity, energized versus de-energized status, and magnetic field strength may be used to move the structure relative to the substrate in conjunction with a closed-loop control system. A bonded substrate assembly and a method of bonding a first wafer to a second wafer include wherein the first wafer includes a projection and the second wafer includes a matching depression. The first and second wafers are bonded together at least in part via magnetic attraction between respective magnetic layers in the projection and the depression.
Abstract translation: 用于将结构组装到衬底上的系统和方法包括设置在衬底下方的可编程磁体的阵列，其中，当结构相对于衬底移动而使结构相对于衬底移动时，将磁场施加到结构以悬浮结构上方的结构，以使结构 在衬底中形成相应的凹槽。 可以施加磁场以相对于衬底平移和旋转结构。 关于磁极性，通电状态与断电状态以及磁场强度的可编程磁体之间或之间的差异可以用于结合闭环控制系统相对于衬底移动结构。 键合衬底组件和将第一晶片接合到第二晶片的方法包括其中第一晶片包括突起，并且第二晶片包括匹配凹陷。 第一和第二晶片至少部分地通过突出部和凹陷中的各个磁性层之间的磁吸引力结合在一起。
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公开(公告)号：US20080315336A1
公开(公告)日：2008-12-25
申请号：US12142897
申请日：2008-06-20
Applicant: Nuggehalli M. Ravindra , Vijay Kasisomayajula , Sudhakar Shet , Anthony T. Fiory
Inventor： Nuggehalli M. Ravindra , Vijay Kasisomayajula , Sudhakar Shet , Anthony T. Fiory
CPC classification number: H01L21/2007 , H01L24/95 , H01L2224/83192 , H01L2224/95092 , H01L2224/95136 , H01L2224/95144 , H01L2924/01004 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/10253 , H01L2924/10272 , H01L2924/10329 , H01L2924/13091 , H01L2924/14 , H01L2924/1423 , H01L2924/1461 , H01L2924/351 , H01L2924/00
Abstract: Systems and methods for assembling a structure onto a substrate include an array of programmable magnets disposed beneath a substrate, wherein a magnetic field is applied to the structure to levitate the structure above the substrate while the structure is moved relative to the substrate to align the structure with a corresponding recess formed in the substrate. A magnetic field may be applied to translate and rotate the structure relative to the substrate. Differences between or among the programmable magnets regarding magnetic polarity, energized versus de-energized status, and magnetic field strength may be used to move the structure relative to the substrate in conjunction with a closed-loop control system. A bonded substrate assembly and a method of bonding a first wafer to a second wafer include wherein the first wafer includes a projection and the second wafer includes a matching depression. The first and second wafers are bonded together at least in part via magnetic attraction between respective magnetic layers in the projection and the depression.
Abstract translation: 用于将结构组装到衬底上的系统和方法包括设置在衬底下方的可编程磁体的阵列，其中，当结构相对于衬底移动而使结构相对于衬底移动时，将磁场施加到结构以悬浮结构上方的结构，以使结构 在衬底中形成相应的凹槽。 可以施加磁场以相对于衬底平移和旋转结构。 关于磁极性，通电状态与断电状态和磁场强度之间的可编程磁体之间或之间的差异可以用于结合闭环控制系统相对于衬底移动结构。 键合衬底组件和将第一晶片接合到第二晶片的方法包括其中第一晶片包括突起，并且第二晶片包括匹配凹陷。 第一和第二晶片至少部分地通过突出部和凹陷中的各个磁性层之间的磁吸引力结合在一起。
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