Semiconductor Device with L-Shaped Spacer and Method of Manufacturing the Same
    1.
    发明申请
    Semiconductor Device with L-Shaped Spacer and Method of Manufacturing the Same 有权
    具有L形隔板的半导体器件及其制造方法

    公开(公告)号:US20070272962A1

    公开(公告)日:2007-11-29

    申请号:US11465881

    申请日:2006-08-21

    CPC classification number: H01L21/28273 H01L27/115 H01L27/11521

    Abstract: A semiconductor device with an L-shape spacer and the method for manufacturing the same are provided. The semiconductor device comprises a substrate, a composite spacer, and a tunnel insulating layer. The substrate comprises a shallow trench isolation structure and a neighboring active area. The composite spacer is formed on the sidewall of the shallow trench isolation structure, and further comprises a first insulating layer and an L-shape second insulating layer spacer, wherein the first insulating layer is located between the L-shape second insulating layer spacer and the substrate. The tunnel insulating layer is located on the substrate of the active area and connects to the first insulating layer of the composite spacer on its corresponding side.

    Abstract translation: 提供具有L形间隔物的半导体器件及其制造方法。 半导体器件包括衬底,复合间隔物和隧道绝缘层。 衬底包括浅沟槽隔离结构和相邻有源区。 复合间隔物形成在浅沟槽隔离结构的侧壁上,还包括第一绝缘层和L形第二绝缘层间隔物,其中第一绝缘层位于L形第二绝缘层间隔物和 基质。 隧道绝缘层位于有源区的衬底上,并与其相应侧上的复合衬垫的第一绝缘层相连。

    Semiconductor device with L-shaped spacer and method of manufacturing the same
    3.
    发明授权
    Semiconductor device with L-shaped spacer and method of manufacturing the same 有权
    具有L形间隔件的半导体器件及其制造方法

    公开(公告)号:US07524732B2

    公开(公告)日:2009-04-28

    申请号:US11465881

    申请日:2006-08-21

    CPC classification number: H01L21/28273 H01L27/115 H01L27/11521

    Abstract: A semiconductor device with an L-shape spacer and the method for manufacturing the same are provided. The semiconductor device comprises a substrate, a composite spacer, and a tunnel insulating layer. The substrate comprises a shallow trench isolation structure and a neighboring active area. The composite spacer is formed on the sidewall of the shallow trench isolation structure, and further comprises a first insulating layer and an L-shape second insulating layer spacer, wherein the first insulating layer is located between the L-shape second insulating layer spacer and the substrate. The tunnel insulating layer is located on the substrate of the active area and connects to the first insulating layer of the composite spacer on its corresponding side.

    Abstract translation: 提供具有L形间隔物的半导体器件及其制造方法。 半导体器件包括衬底,复合间隔物和隧道绝缘层。 衬底包括浅沟槽隔离结构和相邻有源区。 复合间隔物形成在浅沟槽隔离结构的侧壁上,还包括第一绝缘层和L形第二绝缘层间隔物,其中第一绝缘层位于L形第二绝缘层间隔物和 基质。 隧道绝缘层位于有源区的衬底上,并与其相应侧上的复合衬垫的第一绝缘层相连。

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