公开(公告)号：US20110198646A1

公开(公告)日：2011-08-18

申请号：US13024337

申请日：2011-02-10

申请人： Shang-Yi Wu ,  Chien-Hui Chen

发明人： Shang-Yi Wu ,  Chien-Hui Chen

IPC分类号： H01L33/46

CPC分类号： H01L33/60 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01S5/02236 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method for fabricating a silicon submount for LED packaging. A silicon substrate is provided. A reflection layer is formed on the silicon substrate. Portions of the reflection layer and the silicon substrate are removed to form openings. A wafer backside grinding process is carried out to thin the silicon substrate thereby turning the openings into through silicon vias. An insulating layer is then deposited to cover the reflection layer and the silicon substrate. A seed layer is formed on the insulating layer. A resist pattern is then formed on the seed layer. A metal layer is formed on the seed layer not covered by the resist pattern. The resist pattern is then stripped. The seed layer not covered by the metal layer is then removed.

摘要翻译： 一种用于制造用于LED封装的硅基座的方法。 提供硅衬底。 在硅衬底上形成反射层。 去除反射层和硅衬底的部分以形成开口。 进行晶片背面研磨处理以使硅衬底变薄，从而将开口转变成通过硅通孔。 然后沉积绝缘层以覆盖反射层和硅衬底。 种子层形成在绝缘层上。 然后在种子层上形成抗蚀剂图案。 在未被抗蚀剂图案覆盖的种子层上形成金属层。 然后剥离抗蚀剂图案。 然后除去未被金属层覆盖的籽晶层。

公开(公告)号：US07839553B2

公开(公告)日：2010-11-23

申请号：US11833739

申请日：2007-08-03

申请人： Chu-Ming Cheng ,  Shang-Yi Wu

发明人： Chu-Ming Cheng ,  Shang-Yi Wu

IPC分类号： G02B26/02 ,  G02B26/00 ,  G02B27/14 ,  G02B27/10

CPC分类号： G03B21/20 ,  G02B27/48 ,  G03B21/2033 ,  G03B21/2046 ,  G03B21/2053 ,  G03B27/547 ,  G03B33/06 ,  G03B33/12 ,  H04N9/3129 ,  H04N9/3155 ,  H04N9/3164

摘要： A light source module for a scanning projection apparatus is provided. The light source module includes a plurality of point light sources and at least one light blocking unit. Each point light source is capable of providing a color light beam. The color light beams are combined into a combined light beam and the colors of the color light beams are different. The at least one light blocking unit is capable of being inserted into a transmission path of at least one of the color light beams at a fixed frequency to block a portion of the color light beam.

摘要翻译： 提供了一种用于扫描投影装置的光源模块。 光源模块包括多个点光源和至少一个遮光单元。 每个点光源能够提供彩色光束。 彩色光束组合成组合光束，彩色光束的颜色不同。 所述至少一个遮光单元能够以固定频率插入至少一个所述彩色光束的传输路径中，以阻挡所述彩色光束的一部分。

公开(公告)号：US20100181589A1

公开(公告)日：2010-07-22

申请号：US12636657

申请日：2009-12-11

申请人： Tien-Hao HUANG ,  Shang-Yi WU ,  Chia-Lun TSAI

发明人： Tien-Hao HUANG ,  Shang-Yi WU ,  Chia-Lun TSAI

IPC分类号： H01L33/62 ,  H01L21/50

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/1461 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides a chip package structure and method for fabricating the same. The chip package structure includes a carrier substrate. A plurality of isolated conductive layers is disposed on the carrier substrate. At least one chip is disposed on the carrier substrate, wherein the chip has a plurality of electrodes. The electrodes are electrically connected to the conductive layers. A conductive path is disposed in the carrier substrate, electrically connected to the electrodes through the conductive layers, wherein the conductive path comprises a plurality of laminating holes.

摘要翻译： 本发明提供一种芯片封装结构及其制造方法。 芯片封装结构包括载体衬底。 多个隔离的导电层设置在载体衬底上。 至少一个芯片设置在载体基板上，其中芯片具有多个电极。 电极电连接到导电层。 导电路径设置在载体基板中，通过导电层电连接到电极，其中导电路径包括多个层压孔。

公开(公告)号：US20090022187A1

公开(公告)日：2009-01-22

申请号：US12015363

申请日：2008-01-16

申请人： Shang-Yi Wu

发明人： Shang-Yi Wu

IPC分类号： H01S3/10

CPC分类号： H01S5/141 ,  H01S3/109 ,  H01S5/0224 ,  H01S5/041 ,  H01S5/183 ,  H01S5/4062 ,  H01S5/4087

摘要： A laser module including at least one light-emitting unit, a filter and a poled nonlinear optical crystal is provided. The light-emitting unit provides an incoherent beam. The filter is disposed on the transmission path of the incoherent beam and reflects at least a part of the incoherent beam. The poled nonlinear optical crystal is disposed on the transmission path of the incoherent beam, and has a plurality of poled portions. The poled portions have a plurality of first poled portions and a plurality of second poled portions which are alternately disposed. The incoherent beam passes through at least a part of the first poled portions and a part of the second poled portions. At least parts of the poled portions have different average widths from each other in the direction parallel to the chief ray of the incoherent beam.

摘要翻译： 提供了包括至少一个发光单元，滤光器和极化非线性光学晶体的激光模块。 发光单元提供非相干光束。 滤波器设置在非相干光束的传输路径上并且反射非相干光束的至少一部分。 极化非线性光学晶体设置在非相干光束的传输路径上，并且具有多个极化部分。 极化部分具有交替布置的多个第一极化部分和多个第二极化部分。 非相干光束穿过第一极化部分的至少一部分和第二极化部分的一部分。 极化部分的至少一部分在平行于非相干光束的主光线的方向上彼此具有不同的平均宽度。

公开(公告)号：US20080024729A1

公开(公告)日：2008-01-31

申请号：US11760796

申请日：2007-06-11

申请人： Jyh-Horng Shyu ,  Shang-Yi Wu

发明人： Jyh-Horng Shyu ,  Shang-Yi Wu

IPC分类号： G03B21/00

CPC分类号： H04N9/3129 ,  H04N9/3138

摘要： A projection apparatus including an actuator, a light source, and a projection lens is provided. The light source is disposed on the actuator and is capable for emitting light beams sequentially. The actuator is capable for driving the light source so as to change the transmission paths of the light beams. The projection lens is disposed on the transmission paths of the light beams. The volume of the projection apparatus can be reduced since the light source is directly disposed on the actuator.

摘要翻译： 提供了包括致动器，光源和投影透镜的投影设备。 光源设置在致动器上并且能够顺序地发射光束。 致动器能够驱动光源以改变光束的传输路径。 投影透镜设置在光束的传输路径上。 由于光源直接设置在致动器上，投影装置的体积可以减小。

公开(公告)号：US20080018602A1

公开(公告)日：2008-01-24

申请号：US11749551

申请日：2007-05-16

申请人： Chu-Ming Cheng ,  Shang-Yi Wu

发明人： Chu-Ming Cheng ,  Shang-Yi Wu

IPC分类号： G06F3/033

CPC分类号： G06F3/03543 ,  G06F3/0317

摘要： An optical mouse suitable for being put on a surface of an object and including a light source, an image sensor, and a total internal reflection (TIR) prism is provided. The light source is suitable for emitting a light beam, and the TIR prism is disposed between the surface of the object and image sensor located on an optical path of the light beam. The TIR prism has an air gap which reflects the light beam emitted from the light source to the surface. Next, the light beam is reflected by the surface back to the TIR prism, and the light beam reflected by the surface passes through the air gap to be captured by the image sensor. Additionally, an optical mouse using Michelson interference principle is provided. The above-mentioned optical mice improve the accuracy when capturing images and reduce the probability of incorrect image judgment.

摘要翻译： 提供适于放置在物体表面上并包括光源，图像传感器和全内反射（TIR）棱镜的光学鼠标。 光源适用于发射光束，并且TIR棱镜设置在物体的表面和位于光束的光路上的图像传感器之间。 TIR棱镜具有将从光源发射的光束反射到表面的气隙。 接下来，光束被表面反射回TIR棱镜，并且由表面反射的光束穿过气隙以被图像传感器捕获。 另外，提供了使用迈克尔逊干涉原理的光学鼠标。 上述光学鼠标在拍摄图像时提高了精度，并降低了图像判断不正确的可能性。

公开(公告)号：US08866268B2

公开(公告)日：2014-10-21

申请号：US13183446

申请日：2011-07-15

申请人： Shang-Yi Wu ,  Wen-Cheng Chien ,  Chia-Lun Tsai ,  Tien-Hao Huang

发明人： Shang-Yi Wu ,  Wen-Cheng Chien ,  Chia-Lun Tsai ,  Tien-Hao Huang

IPC分类号： H01L29/41 ,  H01L21/283 ,  H01L23/367 ,  H01L33/64 ,  H01L23/00 ,  H01L33/44 ,  H01L23/13 ,  H01L23/498 ,  H01L23/31

CPC分类号： H01L23/3677 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L33/44 ,  H01L33/642 ,  H01L2224/2401 ,  H01L2224/2405 ,  H01L2224/24101 ,  H01L2224/24247 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/73277 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/141 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2933/0075 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package structure and a manufacturing method thereof are provided. The semiconductor package structure includes a semiconductor die, a thermally conductive film, a substrate, a plurality of electrically conductive film patterns, and at least one insulator. The thermally conductive film is disposed on the bottom of the semiconductor die. The substrate is substantially comprised of the electrically conductive material or semiconductor material. Furthermore, a first hole is disposed on and passed all the way through the substrate, and the semiconductor die is disposed in the first hole. The electrically conductive film patterns are disposed on the substrate, and not contacting with each other. In addition, the insulator is connected between the semiconductor die and the substrate.

摘要翻译： 提供半导体封装结构及其制造方法。 半导体封装结构包括半导体管芯，导热膜，衬底，多个导电膜图案和至少一个绝缘体。 导热膜设置在半导体管芯的底部。 衬底基本上由导电材料或半导体材料构成。 此外，第一孔设置在基板上并通过基板，并且半导体管芯设置在第一孔中。 导电膜图案设置在基板上，并且不彼此接触。 此外，绝缘体连接在半导体管芯和衬底之间。

公开(公告)号：US08174044B2

公开(公告)日：2012-05-08

申请号：US12687497

申请日：2010-01-14

申请人： Shang-Yi Wu ,  Tsang-Yu Liu

发明人： Shang-Yi Wu ,  Tsang-Yu Liu

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/48 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light emitting diode package is provided, which includes a semiconductor substrate having a first surface and a second surface; at least a through-hole passing through the semiconductor substrate; a thermal via formed extending from the second surface toward the first surface of the semiconductor substrate, wherein the thermal via has a first end near the first surface and a second end near the second surface; an insulating layer overlying a sidewall of the through-hole and extending overlying the first surface and the second surface of the semiconductor substrate, wherein the insulating layer further covers at least one of the first end, the second end and a sidewall of the thermal via; a conducting layer overlying the insulating layer in the through-hole and extending to the first surface and the second surface of the semiconductor substrate; and an LED chip disposed overlying the semiconductor substrate.

摘要翻译： 提供一种发光二极管封装，其包括具有第一表面和第二表面的半导体衬底; 至少穿过所述半导体衬底的通孔; 所述热通孔从所述第二表面延伸到所述半导体衬底的所述第一表面，其中所述热通孔具有靠近所述第一表面的第一端和靠近所述第二表面的第二端; 绝缘层，其覆盖所述通孔的侧壁并延伸覆盖所述半导体衬底的所述第一表面和所述第二表面，其中所述绝缘层还覆盖所述热通孔的所述第一端，所述第二端和侧壁中的至少一个 ; 覆盖所述通孔中的所述绝缘层并延伸到所述半导体衬底的所述第一表面和所述第二表面的导电层; 以及设置在半导体衬底上的LED芯片。

公开(公告)号：US20110303936A1

公开(公告)日：2011-12-15

申请号：US12813200

申请日：2010-06-10

申请人： Shang-Yi Wu

发明人： Shang-Yi Wu

IPC分类号： H01L33/60 ,  H01L33/48

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device package structure is described. The light emitting device package structure includes a carrier substrate with a top surface and a bottom surface, having at least two through holes. A dielectric mirror structure is formed on the top surface of the carrier substrate, wherein the dielectric mirror structure includes laminating at least five dielectric layer groups, wherein each of the dielectric layer group includes an upper first dielectric layer having a first reflective index and an lower second dielectric layer having a second reflective index smaller than the first reflective index. A first conductive trace and a second conductive trace isolated from each other are formed on the dielectric mirror structure, respectively extending from the top surface to the bottom surface of the carrier substrate along sides of the different through holes. A light emitting device chip is mounted on the top surface of the carrier substrate.

摘要翻译： 描述了发光器件封装结构。 发光器件封装结构包括具有顶表面和底表面的载体衬底，具有至少两个通孔。 电介质镜结构形成在载体衬底的顶表面上，其中电介质镜结构包括层压至少五个电介质层组，其中介电层组中的每一个包括具有第一反射指数的较高的第一介电层和较低的 第二电介质层的第二反射率小于第一反射率。 在电介质镜结构上形成分别彼此隔离的第一导电迹线和第二导电迹线，分别从不同通孔的侧面从载体基板的顶表面延伸到底表面。 发光器件芯片安装在载体衬底的顶表面上。

公开(公告)号：US20100148210A1

公开(公告)日：2010-06-17

申请号：US12636660

申请日：2009-12-11

申请人： Tien-Hao HUANG ,  Shang-Yi Wu

发明人： Tien-Hao HUANG ,  Shang-Yi Wu

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/1461 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An embodiment of the invention provides a package structure for chip. The package structure for chip includes: a carrier substrate having an upper surface and an opposite lower surface; a chip overlying the carrier substrate and having a first surface and an opposite second surface facing the upper surface, wherein the chip includes a first electrode and a second electrode; a first conducting structure overlying the carrier substrate and electrically connecting the first electrode; a second conducting structure overlying the carrier substrate and electrically connecting the second electrode; a first through-hole penetrating the upper surface and the lower surface of the carrier substrate and disposed next to the chip without overlapping the chip; a first conducting layer overlying a sidewall of the first through-hole and electrically connecting the first conducting electrode; and a third conducting structure overlying the carrier substrate and electrically connecting the second conducting structure.

摘要翻译： 本发明的实施例提供了一种用于芯片的封装结构。 用于芯片的封装结构包括：具有上表面和相对的下表面的载体衬底; 覆盖所述载体衬底并且具有面向所述上表面的第一表面和相对的第二表面的芯片，其中所述芯片包括第一电极和第二电极; 覆盖所述载体基板并电连接所述第一电极的第一导电结构; 覆盖所述载体基板并电连接所述第二电极的第二导电结构; 穿过载体基板的上表面和下表面的第一通孔，并且设置在芯片旁边而不与芯片重叠; 覆盖所述第一通孔的侧壁并电连接所述第一导电电极的第一导电层; 以及覆盖所述载体基板并电连接所述第二导电结构的第三导电结构。