-
公开(公告)号:US07324863B2
公开(公告)日:2008-01-29
申请号:US11394286
申请日:2006-03-30
IPC分类号: G06F19/00
CPC分类号: G05B19/41875 , G05B2219/32186 , G05B2219/32206 , G05B2219/45031 , Y02P90/22
摘要: In one embodiment, the present invention includes a method for receiving a set of inspection files each corresponding to an inspection performed on a wafer of a set of wafers, automatically analyzing the set of inspection files to select at least one inspection file corresponding to a predetermined rule set, and identifying the wafer(s) associated with the selected inspection file(s). Other embodiments are described and claimed.
摘要翻译: 在一个实施例中,本发明包括一种用于接收一组检查文件的方法,每个检查文件对应于在一组晶片的晶片上进行的检查,自动分析检查文件集合,以选择至少一个与预定的 规则集,以及识别与所选择的检查文件相关联的晶片。 描述和要求保护其他实施例。
-
公开(公告)号:US20070239306A1
公开(公告)日:2007-10-11
申请号:US11394286
申请日:2006-03-30
申请人: Paul Thirumalai , Rick Mayer , Mike Wodarczyk
发明人: Paul Thirumalai , Rick Mayer , Mike Wodarczyk
IPC分类号: G06F19/00
CPC分类号: G05B19/41875 , G05B2219/32186 , G05B2219/32206 , G05B2219/45031 , Y02P90/22
摘要: In one embodiment, the present invention includes a method for receiving a set of inspection files each corresponding to an inspection performed on a wafer of a set of wafers, automatically analyzing the set of inspection files to select at least one inspection file corresponding to a predetermined rule set, and identifying the wafer(s) associated with the selected inspection file(s). Other embodiments are described and claimed.
摘要翻译: 在一个实施例中,本发明包括一种用于接收一组检查文件的方法,每个检查文件对应于在一组晶片的晶片上进行的检查,自动分析检查文件集合,以选择至少一个与预定的 规则集,以及识别与所选择的检查文件相关联的晶片。 描述和要求保护其他实施例。
-