公开(公告)号：US5985687A

公开(公告)日：1999-11-16

申请号：US630675

申请日：1996-04-12

Applicant: John E. Bowers ,  R. Kehl Sink ,  Steven P. Denbaars

Inventor： John E. Bowers ,  R. Kehl Sink ,  Steven P. Denbaars

IPC: H01S5/02 ,  H01S5/323 ,  H01L21/00

CPC classification number: H01S5/0201 ,  H01L2221/68363 ,  H01S5/0202 ,  H01S5/32341 ,  Y10S438/967 ,  Y10S438/977

Abstract: Optically flat cleaved facet mirrors are fabricated in GaN epitaxial films grown on sapphire by wafer fusing a GaN film with a sapphire substrate to a cubic substrate such as an InP or GaAs substrate. The sapphire substrate may then partially or entirely removed by lapping, dry etching, or wet etching away a sacrificial layer disposed in the interface between the sapphire substrate and the GaN layer. Thereafter, the cubic InP or GaN substrate is cleaved to produce the cubic crystal facet parallel to the GaN layer in which active devices are fabricated for use in lasers, photodetectors, light emitting diodes and other optoelectronic devices.

Abstract translation: 通过晶片将蓝宝石衬底的GaN膜与InP或GaAs衬底等立方体衬底熔合而制造在蓝宝石上生长的GaN外延膜中的光学平面切面镜。 然后可以通过研磨，干蚀刻或湿蚀刻去除设置在蓝宝石衬底和GaN层之间的界面中的牺牲层来部分或全部去除蓝宝石衬底。 此后，立方InP或GaN衬底被切割以产生平行于GaN层的立方晶体晶面，其中制造用于激光器，光电检测器，发光二极管和其它光电子器件的有源器件。

公开(公告)号：US06681473B1

公开(公告)日：2004-01-27

申请号：US10078066

申请日：2002-02-15

Applicant: Bin Liu ,  R. Kehl Sink ,  David Welsh ,  Yuanjian Xu

Inventor： Bin Liu ,  R. Kehl Sink ,  David Welsh ,  Yuanjian Xu

IPC: G02B600

CPC classification number: G02B6/3644 ,  G02B6/3676 ,  G02B6/3688 ,  G02B6/3692 ,  Y10T29/49885 ,  Y10T29/49982 ,  Y10T29/49993

Abstract: A method and apparatus hermetically sealing a fiber array block is described. In one embodiment, a fiber array plate is fabricated and an array of tapered holes formed therein. An adhering metal layer, such as a titanium, nickel and gold multilayer, is deposited upon the fiber array plate. A solder preform is positioned on the fiber array plate so that the array of holes in the solder preform corresponds to the array of holes in the array plate. Fibers having an adhering metal layer deposited thereon, are then inserted through the fiber array plate. The tapered holes make the fiber insertion process easier. The fiber array plate is then heated such that the solder preform melts causing the solder to fill any gaps between the fiber array plates and the fiber. When the solder cools a hermetic seal is formed while the fibers remain accurately positioned.

Abstract translation: 描述了密封光纤阵列块的方法和设备。 在一个实施例中，制造了光纤阵列板，并且形成了一组锥形孔。 附着的金属层，例如钛，镍和金多层，沉积在纤维阵列板上。 焊料预制件位于纤维阵列板上，使得焊料预制件中的孔阵列对应于阵列板中的孔阵列。 然后将其上沉积有附着金属层的纤维插入穿过纤维阵列板。 锥形孔使纤维插入过程更容易。 然后加热纤维阵列板，使​​得焊料预制件熔化，导致焊料填充纤维阵列板和纤维之间的任何间隙。 当焊料冷却时，在纤维保持精确定位的同时形成气密密封。