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公开(公告)号：US20050013476A1
公开(公告)日：2005-01-20
申请号：US10890933
申请日：2004-07-14
申请人： Patrick Simpkins
发明人： Patrick Simpkins
IPC分类号： G06K9/00 , G06T7/00 , H01L20060101
CPC分类号： G06T7/0004 , G06T2207/30148
摘要： An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.
摘要翻译： 边缘珠去除测量方法包括确定围绕晶片的圆周的晶片的边缘。 确定晶片边缘上的晶片切口的位置。 确定晶片中心的位置。 确定从晶片边缘到围绕晶片圆周的边缘珠去除线的距离。
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公开(公告)号：US20080002877A1
公开(公告)日：2008-01-03
申请号：US11676140
申请日：2007-02-16
申请人： Patrick Simpkins
发明人： Patrick Simpkins
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G06T2207/30148
摘要： An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.
摘要翻译： 边缘珠去除测量方法包括确定围绕晶片的圆周的晶片的边缘。 确定晶片边缘上的晶片切口的位置。 确定晶片中心的位置。 确定从晶片边缘到围绕晶片圆周的边缘珠去除线的距离。
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公开(公告)号：US20050052530A1
公开(公告)日：2005-03-10
申请号：US10890862
申请日：2004-07-14
申请人： Patrick Simpkins , Cory Watkins
发明人： Patrick Simpkins , Cory Watkins
CPC分类号： H04N7/188 , G01N21/8806 , G01N21/9501
摘要： An inspection tool includes a camera having a gain value and an offset value set to provide a first camera output indicating a first desired average gray value when the camera is illuminated with a precision light source set at a first light level. The inspection tool includes an inspection light source configured to be set at a second light level such that when the inspection light source illuminates a known target, the camera provides a second output indicating a second desired average gray value.
摘要翻译： 检查工具包括具有增益值和偏移值的相机，所述偏移值被设置为当用在第一光级设置的精密光源照明相机时，提供指示第一期望平均灰度值的第一相机输出。 检查工具包括被配置为被设置在第二光级的检查光源，使得当检查光源照亮已知目标时，照相机提供指示第二期望平均灰度值的第二输出。
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公开(公告)号：US20050041850A1
公开(公告)日：2005-02-24
申请号：US10890734
申请日：2004-07-14
申请人： Cory Watkins , Patrick Simpkins
发明人： Cory Watkins , Patrick Simpkins
CPC分类号： G06T5/006 , G06T5/008 , G06T2207/30148 , Y10T29/49131
摘要： An inspection tool comprises a camera for obtaining images of a wafer and a controller configured for performing light source flat field correction, optical image warping correction, and optical image scale correction of the images.
摘要翻译： 检查工具包括用于获得晶片的图像的相机和被配置为执行光源平场校正，光学图像翘曲校正和图像的光学图像尺度校正的控制器。
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公开(公告)号：US08045788B2
公开(公告)日：2011-10-25
申请号：US10890734
申请日：2004-07-14
申请人： Cory Watkins , Patrick Simpkins
发明人： Cory Watkins , Patrick Simpkins
IPC分类号： G06K9/00
CPC分类号： G06T5/006 , G06T5/008 , G06T2207/30148 , Y10T29/49131
摘要： An inspection tool includes a camera for obtaining images of a wafer and a controller configured for performing light source flat field correction, optical image warping correction, and optical image scale correction of the images. In operation, separate inspection tools are calibrated separately to obtain a characteristic response with respect to imaging and/or illumination for each such inspection tool. A standard target is then imaged by each inspection tool and the response of each of the inspection tools is normalized to ensure uniformity of the output of each inspection tool with respect to the other inspection tools.
摘要翻译： 检查工具包括用于获得晶片的图像的相机和被配置为执行光源平场校正，光学图像翘曲校正和图像的光学图像尺度校正的控制器。 在操作中，单独的检查工具被单独校准以获得关于每个这种检查工具的成像和/或照明的特征响应。 然后通过每个检查工具对标准目标进行成像，并且对每个检查工具的响应进行归一化以确保每个检查工具相对于其他检查工具的输出的均匀性。
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公开(公告)号：US07684611B2
公开(公告)日：2010-03-23
申请号：US11676140
申请日：2007-02-16
申请人： Patrick Simpkins
发明人： Patrick Simpkins
CPC分类号： G06T7/0004 , G06T2207/30148
摘要： An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.
摘要翻译： 边缘珠去除测量方法包括确定围绕晶片的圆周的晶片的边缘。 确定晶片边缘上的晶片切口的位置。 确定晶片中心的位置。 确定从晶片边缘到围绕晶片圆周的边缘珠去除线的距离。
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公开(公告)号：US07589783B2
公开(公告)日：2009-09-15
申请号：US10890862
申请日：2004-07-14
申请人： Patrick Simpkins , Cory Watkins
发明人： Patrick Simpkins , Cory Watkins
CPC分类号： H04N7/188 , G01N21/8806 , G01N21/9501
摘要： An inspection tool includes a camera having a gain value and an offset value set to provide a first camera output indicating a first desired average gray value when the camera is illuminated with a precision light source set at a first light level. The inspection tool includes an inspection light source configured to be set at a second light level such that when the inspection light source illuminates a known target, the camera provides a second output indicating a second desired average gray value.
摘要翻译： 检查工具包括具有增益值和偏移值的相机，所述偏移值被设置为当用在第一光级设置的精密光源照明相机时，提供指示第一期望平均灰度值的第一相机输出。 检查工具包括被配置为被设置在第二光级的检查光源，使得当检查光源照亮已知目标时，照相机提供指示第二期望平均灰度值的第二输出。
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公开(公告)号：US07197178B2
公开(公告)日：2007-03-27
申请号：US10890933
申请日：2004-07-14
申请人： Patrick Simpkins
发明人： Patrick Simpkins
CPC分类号： G06T7/0004 , G06T2207/30148
摘要： An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.
摘要翻译： 边缘珠去除测量方法包括确定围绕晶片的圆周的晶片的边缘。 确定晶片边缘上的晶片切口的位置。 确定晶片中心的位置。 确定从晶片边缘到围绕晶片圆周的边缘珠去除线的距离。
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