公开(公告)号：US4155109A

公开(公告)日：1979-05-15

申请号：US862083

申请日：1977-12-19

Applicant: Larry R. Finch ,  Joseph D. Roche ,  Paul M. Rogers

Inventor： Larry R. Finch ,  Joseph D. Roche ,  Paul M. Rogers

IPC: H05K7/14 ,  H02B1/02

CPC classification number: H05K7/1408

Abstract: An electronic package assembly having means for providing direct interconnection for one or more planar electronic circuit boards with a nearly conventional card-on-board circuit package. Electrical interconnection between the card-on-board package and the planar boards is accomplished with the use of interposer cards that utilize a pin and spring blade contact system and printed circuitry to connect corresponding pins on the planar boards and the card-on-board package. The mechanical advantage necessary to overcome the spring contact force encountered in insertion and extraction of the planar boards is provided by a unique lever arrangement which latches and unlatches the planar boards.

Abstract translation: 一种具有用于为具有几乎常规的板上电路板封装的一个或多个平面电子电路板提供直接互连的装置的电子封装组件。 卡上板卡封装和平板之间的电气互连是通过使用插入卡来实现的，所述插入卡利用销和弹簧片接触系统以及印刷电路来连接平面板上的相应引脚和板上板卡封装 。 克服在平面板的插入和抽出过程中遇到的弹簧接触力所需的机械优点是通过一种独特的杠杆装置提供的，该装置锁定和解开平面板。

公开(公告)号：US2793325A

公开(公告)日：1957-05-21

申请号：US40669654

申请日：1954-01-28

Applicant: PAUL M ROGERS

Inventor： WENZEL ROBERT H

IPC: H01J21/08

CPC classification number: H01J21/08

公开(公告)号：US5324570A

公开(公告)日：1994-06-28

申请号：US993968

申请日：1992-12-17

Applicant: Joseph M. Ommen ,  Paul M. Rogers

Inventor： Joseph M. Ommen ,  Paul M. Rogers

IPC: H01L23/13 ,  H01L21/50 ,  H01L23/04 ,  H01L23/08 ,  H01L23/12 ,  H01L23/498 ,  B32B9/00

CPC classification number: H01L21/50 ,  H01L23/49844 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: A microelectronics substrate assembly comprising: an advanced ceramics substrate having a top surface and a bottom surface; a first metallized distribution plane on said top surface and a second metallized distribution plane on said bottom surface; an electrical connection between said first and second distribution planes; at least one first metallized pad on said top surface electrically isolated from said first distribution plane and at least one metallized pad on said bottom surface, electrically isolated from said second distribution plane, wherein said distribution planes and said metallized pads are arranged substantially symmetrically with respect to a plane between and parallel to said top and said bottom surfaces.

Abstract translation: 一种微电子衬底组件，包括：具有顶表面和底表面的先进陶瓷衬底; 所述顶表面上的第一金属化分配平面和所述底表面上的第二金属化分配平面; 所述第一和第二分配平面之间的电连接; 所述顶表面上的至少一个第一金属化焊盘与所述第一分配平面电隔离，并且所述底表面上的至少一个金属化焊盘与所述第二分布平面电隔离，其中所述分布平面和所述金属化焊盘相对于 到与所述顶部和所述底部表面平行的平面。