公开(公告)号：US07723619B2

公开(公告)日：2010-05-25

申请号：US10589883

申请日：2004-03-19

申请人： Katsuhide Ohashi ,  Shigeo Amagi ,  Osamu Miyo ,  Sadayuki Aoki

发明人： Katsuhide Ohashi ,  Shigeo Amagi ,  Osamu Miyo ,  Sadayuki Aoki

IPC分类号： H05K1/16

CPC分类号： B29C45/0025 ,  B29C45/14377 ,  B29C45/14639 ,  B29C2045/14893 ,  B29L2031/3061 ,  H01R13/405 ,  H01R43/24

摘要： Continuous annular resin bands surrounding electrical contact portions of respective terminals are disposed without gaps between the electrical contact portions of respective terminals and resin members that fixedly hold the terminals; there are formed gaps among the adjoining resin bands. Gaps are formed among a bundle of terminals having annular resin bands and resin members surrounding the bundle. A partial adhesion is formed at the interface between the terminals and the resin by a low cost manufacturing method, whereby a molding with high air-tightness between the interior and exterior thereof and high reliability is realized.

摘要翻译： 围绕各个端子的电接触部分的连续的环形树脂带在各端子的电接触部分和固定住端子的树脂构件之间没有间隙地设置; 在相邻的树脂带之间形成间隙。 在具有环形树脂带和围绕束的树脂构件的一束端子之间形成间隙。 通过低成本制造方法在端子和树脂之间的界面处形成部分粘附，从而实现其内部和外部之间具有高气密性的模制品和高可靠性。

公开(公告)号：US20100052213A1

公开(公告)日：2010-03-04

申请号：US12616826

申请日：2009-11-12

申请人： Katsuhide OOHASHI ,  Shigeo AMAGI ,  Osamu MIYO

发明人： Katsuhide OOHASHI ,  Shigeo AMAGI ,  Osamu MIYO

IPC分类号： B29C45/14

CPC分类号： H05K5/0069 ,  B29C45/14639 ,  B29C45/1671 ,  B29C70/72 ,  B29C71/0063 ,  B29C2045/14893 ,  B29K2995/0041 ,  H01R43/24

摘要： A pre-mold part is formed by pre-molding the insert with the pre-molded part, and then the pre-molded part is inserted into the over-molded part composed of thermo plastic resin. After applying a heat treatment with the temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert formed as the composite mold part surrounding the pre-mold part, a firm contact between the insert and the resin surrounding the insert part without no gap at the interface between those parts is obtained.

摘要翻译： 预成型部通过将预成型部件预成型而形成，然后将预成型部插入由热塑性树脂构成的外部成型部。 在将低于预成型部件的结晶熔点的温度进行热处理后，围绕作为围绕预模具部件的复合模具部件形成的插入件的预成型部件，插入件与 获得在这些部件之间的界面处没有间隙的插入部件周围的树脂。

公开(公告)号：US07255610B2

公开(公告)日：2007-08-14

申请号：US11320782

申请日：2005-12-30

申请人： Katsuhide Oohashi ,  Shigeo Amagi ,  Osamu Miyo

发明人： Katsuhide Oohashi ,  Shigeo Amagi ,  Osamu Miyo

IPC分类号： H01R13/405

CPC分类号： B29C45/1671 ,  B29C37/005 ,  B29C45/14639 ,  B29K2067/006 ,  B29K2709/08 ,  B29L2031/3061 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/85181 ,  H01R13/405 ,  H01R43/24 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.

摘要翻译： 提供一种用于电子设备的整体多模塑部件，其能够吸收和减轻多个模制部件的内部应力，从而防止每个电连接端子的接合侧面与树脂之间产生间隙，从而获得稳定的摩擦力 电连接端子的接合面和铝线之间的接触区域，获得接合所需的能量，并实现高的粘合性。 形成为一次成型制品的模制电气连接端子部分的表面在二次模塑之后暴露，并且在作为应力传输路径的一次成型制品的一次模制树脂部分中形成应力吸收结构 与二次模塑树脂固化时发生的树脂收缩有关。

公开(公告)号：US20060186522A1

公开(公告)日：2006-08-24

申请号：US11320782

申请日：2005-12-30

申请人： Katsuhide Oohashi ,  Shigeo Amagi ,  Osamu Miyo

发明人： Katsuhide Oohashi ,  Shigeo Amagi ,  Osamu Miyo

IPC分类号： H01L23/02

CPC分类号： B29C45/1671 ,  B29C37/005 ,  B29C45/14639 ,  B29K2067/006 ,  B29K2709/08 ,  B29L2031/3061 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/85181 ,  H01R13/405 ,  H01R43/24 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.

摘要翻译： 提供一种用于电子设备的整体多模塑部件，其能够吸收和减轻多个模制部件的内部应力，从而防止每个电连接端子的接合侧面与树脂之间产生间隙，从而获得稳定的摩擦力 电连接端子的接合面和铝线之间的接触区域，获得接合所需的能量，并实现高的粘合性。 形成为一次成型制品的模制电气连接端子部分的表面在二次模塑之后暴露，并且在作为应力传输路径的一次成型制品的一次模制树脂部分中形成应力吸收结构 与二次模塑树脂固化时发生的树脂收缩有关。

公开(公告)号：US20060001192A1

公开(公告)日：2006-01-05

申请号：US11167791

申请日：2005-06-28

申请人： Katsuhide Oohashi ,  Shigeo Amagi ,  Osamu Miyo

发明人： Katsuhide Oohashi ,  Shigeo Amagi ,  Osamu Miyo

IPC分类号： B29C39/10

CPC分类号： H05K5/0069 ,  B29C45/14639 ,  B29C45/1671 ,  B29C70/72 ,  B29C71/0063 ,  B29C2045/14893 ,  B29K2995/0041 ,  H01R43/24

摘要： A pre-mold part is formed by pre-molding the insert part composed of composite materials composed of metal, ceramic, resin or any combination of those materials with the pre-mold part composed of thermo plastic resin having crystallinity, and then, the pre-mold part is inserted into the over-mold part composed of thermo plastic resin. After applying the heat treatment with the temperature lower than the crystalline melting point of the pre-mold part to the pre-mold part surrounding the insert part formed as the composite mold part surrounding the pre-mold part, the insert molding is completed finally. Mold parts having high-reliable insert parts enable to establish firm contact between the insert part and the resin surrounding the insert part without no gap at the interface between those parts can be obtained by a low-cost production method.

摘要翻译： 通过将由金属，陶瓷，树脂或这些材料的任何组合构成的复合材料构成的插入部件与由具有结晶性的热塑性树脂组成的预成型部件预成型，形成预成型部分，然后， - 将模具部分插入由热塑性树脂组成的上模部分。 在将温度低于预成型部件的结晶熔点的热处理施加到形成为围绕预模具部件的复合模具部件的插入部件周围的预成型部件之前，最后完成嵌件成型。 具有高可靠性插入部件的模具部件能够通过低成本的生产方法获得插入部件与插入部件周围的树脂之间的牢固接触，而在这些部件之间的界面处没有间隙。

公开(公告)号：US08784715B2

公开(公告)日：2014-07-22

申请号：US12616826

申请日：2009-11-12

申请人： Katsuhide Oohashi ,  Shigeo Amagi ,  Osamu Miyo

发明人： Katsuhide Oohashi ,  Shigeo Amagi ,  Osamu Miyo

IPC分类号： B29C45/14

CPC分类号： H05K5/0069 ,  B29C45/14639 ,  B29C45/1671 ,  B29C70/72 ,  B29C71/0063 ,  B29C2045/14893 ,  B29K2995/0041 ,  H01R43/24

摘要： A pre-molded part is formed by pre-molding an insert with a pre-molded member, and then the pre-molded part is inserted into an over-molded member composed of thermo plastic resin. After applying a heat treatment with a temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert, a firm contact between the insert and the resin surrounding the insert without a gap at the interface between those parts is obtained.

摘要翻译： 通过用预成型体预成型插入物形成预成型部，然后将预成型部插入由热塑性树脂构成的覆盖成型体。 在将低于预成型部件的结晶熔点的温度进行热处理之后，将其插入到围绕插入件的预成型部件之间，在插入件与树脂周围的固定接触件之间的界面处没有间隙 获得零件。