摘要:
A projector includes an optical element and a cooling device configured to supply cooling air along the surface of the optical element. The cooling device supplies the cooling air in two supply directions crossing each other and extending from one edge to the other edge of two opposed edges of the optical element.
摘要:
A projector includes: a cooling device which supplies cooling air to a cooling target, wherein the cooling device includes a plurality of cooling fans each of which discharges cooling air, and a plurality of ducts each one end of which is connected with the corresponding one of the plural cooling fans to introduce the cooling air toward the cooling target in directions different from each other, and the plural ducts communicate with each other at the other end and have an outlet port through which the cooling air flows out.
摘要:
An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area.
摘要:
A projector includes: a plurality of light modulating devices; a light combining optical device having a plurality of light incidence planes that faced a corresponding one of the light modulating devices, the light combining optical device configured to combine the color lights modulated by the plurality of light modulating devices; and fixing members each having a plate-like base in which an opening is formed, the fixing members configured to fix the light modulating devices to the light combining optical device, the light modulating devices are fixed to the fixing members in a state in which the light modulating devices are inserted in the openings.
摘要:
In a lighting device, a first LED is formed by sealing a blue LED element by a first resin, the first resin having a first phosphor included in the first resin so as to raise a correlation color temperature of an emitted light color; and a second LED is formed by sealing a blue LED element by a second resin, the second resin having a second phosphor included in the second resin so as to lower a correlation color temperature of an emitted light color. The lighting device emits light from white light of a color having a first correlation color temperature to white light of a color having a second correlation color temperature, and the first correlation color temperature is higher than the second correlation color temperature. Consequently, various tones of white light can be more easily adjusted and controlled over a long period.
摘要:
An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area.
摘要:
A light-emitting diode includes a circuit board, a pair of electrodes provided on the circuit board, at least one light-emitting diode element electrically connected to the pair of electrodes, a central electrode for heat-dissipation, provided between the pair of electrodes on the circuit board, and a heat-dissipation plate disposed on the central electrode for heat-dissipation and including a reflection surface. The central electrode for heat-dissipation includes an upper central electrode disposed on the upper surface of the circuit board and a lower central electrode disposed on the lower surface of the circuit board and the upper central electrode thermally connected to the lower central electrode.
摘要:
A projector (1) includes a light source device (2), a light modulating device (5) that modulates a light beam emitted from the light source device (2), a projection optical device (7) that projects the light beam modulated by the light modulating device (5), a flexible printed circuit board (6), one end of which is connected to the light modulating device (5), and a housing (8) in which the light source device (2), the light modulating device (5), and the projection optical device (7) are housed. In a position in the housing (8) where the light modulating device (5) is disposed, a first insert-through section (8L1) for drawing around the flexible printed circuit (6) board to the outside (8L) of the housing (8) and a second insert-through section (8D1), through which a part of the light modulating device (5) is inserted, are formed.
摘要:
A projector (1) includes a light source device (2), a light modulating device (5) configured to modulate a light beam emitted from the light source device, a projection optical device (7) configured to project the light beam modulated by the light modulating device, and a flexible printed circuit board (6), one end of which is connected to the light modulating device (5). The light source device (2) includes a light emitting device mounted on the flexible printed circuit board (6). The flexible printed circuit board is bent, whereby the light source device is disposed in an emission position where the light source device (2) emits the light beam to the light modulating device (5).
摘要:
A light-emitting diode includes a circuit board, a pair of electrodes provided on the circuit board, at least one light-emitting diode element electrically connected to the pair of electrodes, a central electrode for heat-dissipation, provided between the pair of electrodes on the circuit board, and a heat-dissipation plate disposed on the central electrode for heat-dissipation and including a reflection surface. The central electrode for heat-dissipation includes an upper central electrode disposed on the upper surface of the circuit board and a lower central electrode disposed on the lower surface of the circuit board and the upper central electrode thermally connected to the lower central electrode.