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公开(公告)号：US08791491B2
公开(公告)日：2014-07-29
申请号：US13164185
申请日：2011-06-20
申请人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
发明人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
CPC分类号： H01L33/52 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/4554
摘要： A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
摘要翻译： 用于发光器件封装的基座包括衬底。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。
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公开(公告)号：US08138000B2
公开(公告)日：2012-03-20
申请号：US12397555
申请日：2009-03-04
IPC分类号： H01L21/00
CPC分类号： H01L33/507 , H01L25/167 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.
摘要翻译： 半导体发光器件的基座包括其中具有腔室的半导体衬底，其配置为接收发光器件。 第一接合焊盘定位在空腔中以耦合到容纳在空腔中的发光器件的第一节点。 第二接合焊盘定位在空腔中以耦合到定位在其中的发光器件的第二节点。 还提供了包括固体波长转换元件的发光器件及其形成方法。
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公开(公告)号：US20110273645A1
公开(公告)日：2011-11-10
申请号：US13184102
申请日：2011-07-15
IPC分类号： G02F1/13357
CPC分类号： G02F1/133615 , G02B6/0028 , G02B6/0038 , G02B6/0068 , G02B6/0076 , G02F1/133524 , G02F1/133603
摘要： A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.
摘要翻译： 一种LCD系统，包括通过不同光入射区域光耦合到至少一个波导元件的多个光源，定位成背光LCD面板。 一种LCD系统，包括耦合到两个或多个波导的光入射区域的多个光源，包括定位成背光LCD面板的波导系统。 提供各种配置的波导，并促进相关LCD面板的均匀照明。 所得到的LCD系统使得具有超过12至14英寸的对角线测量的均匀照明的面板，但是本发明不限于任何特定尺寸的面板。
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公开(公告)号：US07964888B2
公开(公告)日：2011-06-21
申请号：US11788001
申请日：2007-04-18
申请人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
发明人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
IPC分类号： H01L33/00
CPC分类号： H01L33/52 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/4554
摘要： A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
摘要翻译： 用于发光器件封装的基座包括矩形基板。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。
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5.发明申请METHODS OF SELECTIVELY APPLYING LUMINOUS MATERIAL TO LIGHT EMITTING DEVICES BASED ON MEASURED OUTPUT THEREOF 有权基于测量的输出将选择性地将光源材料应用于发光装置的方法公开(公告)号：US20110070669A1
公开(公告)日：2011-03-24
申请号：US12951177
申请日：2010-11-22
申请人： Norbert Hiller , Scott Schwab , Gerald H. Negley
发明人： Norbert Hiller , Scott Schwab , Gerald H. Negley
IPC分类号： H01L21/66
CPC分类号： H01L27/156 , H01L33/508
摘要： A light emitting apparatus is fabricated by measuring light output of a semiconductor light emitting device, and selectively applying luminous material to the light emitting device based on the measured output of the light emitting device. An amount of luminous material, different compositions of luminous material and/or different doping levels of luminous material may be selectively applied based on the measured output of the light emitting device.
摘要翻译： 通过测量半导体发光器件的光输出并基于测量的发光器件的输出，将发光材料选择性地施加到发光器件来制造发光器件。 可以基于测量的发光装置的输出来选择性地施加发光材料的量，发光材料的不同组成和/或发光材料的不同掺杂水平。
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6.发明申请METHODS OF SELECTIVELY REMOVING LUMINOUS MATERIAL FROM A LIGHT EMITTING DEVICE BASED ON MEASURED OUTPUT THEREOF 审中-公开基于测量输出的光发射装置选择性地去除光泽材料的方法公开(公告)号：US20110070668A1
公开(公告)日：2011-03-24
申请号：US12951171
申请日：2010-11-22
申请人： Norbert Hiller , Scott Schwab , Gerald H. Negley
发明人： Norbert Hiller , Scott Schwab , Gerald H. Negley
IPC分类号： H01L21/66
CPC分类号： H01L27/156 , H01L33/508
摘要： A light emitting apparatus is provided that includes a light emitting device and luminous material thereon. Light output of the light emitting apparatus is measured. Some of the luminous material is selectively removed from the light emitting device based on the output of the light emitting apparatus that was measured, so that luminous material that remains on the light emitting device after the selective removing continues to be optically excited by light that is generated by the light emitting device. In measuring, a frequency spectrum of the light emitting apparatus may be measured, and the light emitting apparatus may emit white light after the selectively removing.
摘要翻译： 提供了一种发光装置，其包括发光装置和其上的发光材料。 测量发光装置的光输出。 基于测量的发光装置的输出，从发光器件选择性地去除一些发光材料，使得在选择性去除之后残留在发光器件上的发光材料继续被光 由发光器件产生。 在测量中，可以测量发光装置的频谱，并且在选择性去除之后发光装置可以发出白光。
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公开(公告)号：US07872705B2
公开(公告)日：2011-01-18
申请号：US11829912
申请日：2007-07-29
IPC分类号： G02F1/1335
CPC分类号： G02F1/133615 , G02B6/0028 , G02B6/0038 , G02B6/0068 , G02B6/0076 , G02F1/133524 , G02F1/133603
摘要： A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.
摘要翻译： 一种LCD系统，包括通过不同光入射区域光耦合到至少一个波导元件的多个光源，定位成背光LCD面板。 一种LCD系统，包括耦合到两个或多个波导的光入射区域的多个光源，包括定位成背光LCD面板的波导系统。 提供各种配置的波导，并促进相关LCD面板的均匀照明。 所得到的LCD系统使得具有超过12至14英寸的对角线测量的均匀照明的面板，但是本发明不限于任何特定尺寸的面板。
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8.发明授权公开(公告)号：US07858403B2
公开(公告)日：2010-12-28
申请号：US10267093
申请日：2002-10-04
申请人： Norbert Hiller , Scott Schwab , Gerald H. Negley
发明人： Norbert Hiller , Scott Schwab , Gerald H. Negley
IPC分类号： H01L21/66
CPC分类号： H01L27/156 , H01L33/508
摘要： Broad spectrum light emitting devices and methods and systems for fabricating such devices are provide. Such devices may include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies, and luminous material on the light emitting diode. The characteristics of the luminous material, such as the amount, composition and/or doping of the luminous material or materials may be based on measured light output of the light emitting device, such as the measured output frequency and/or power of the light emitting device.
摘要翻译： 提供了用于制造这种器件的广谱发光器件和方法和系统。 这样的装置可以包括发射预定频率范围内的光的发光元件，例如二极管或激光器，以及发光二极管上的发光材料。 发光材料的特性，例如发光材料或材料的量，组成和/或掺杂可以基于测量的发光器件的光输出，例如测量的输出频率和/或发光功率 设备。
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公开(公告)号：US20090027588A1
公开(公告)日：2009-01-29
申请号：US11829912
申请日：2007-07-29
IPC分类号： G02F1/13357
CPC分类号： G02F1/133615 , G02B6/0028 , G02B6/0038 , G02B6/0068 , G02B6/0076 , G02F1/133524 , G02F1/133603
摘要： A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.
摘要翻译： 一种LCD系统，包括通过不同光入射区域光耦合到至少一个波导元件的多个光源，定位成背光LCD面板。 一种LCD系统，包括耦合到两个或多个波导的光入射区域的多个光源，包括定位成背光LCD面板的波导系统。 提供各种配置的波导，并促进相关LCD面板的均匀照明。 所得到的LCD系统使得具有超过12至14英寸的对角线测量的均匀照明的面板，但是本发明不限于任何特定尺寸的面板。
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10.发明申请LIGHT EMITTING DEVICE (LED) LIGHTING SYSTEMS FOR EMITTING LIGHT IN MULTIPLE DIRECTIONS AND RELATED METHODS 审中-公开用于发射多个方向的灯的发光装置（LED）照明系统及相关方法公开(公告)号：US20090002979A1
公开(公告)日：2009-01-01
申请号：US11928112
申请日：2007-10-30
CPC分类号： F21V7/0016 , F21V9/30 , F21V9/40 , F21Y2107/90 , F21Y2115/10
摘要： Some embodiments of the present invention provide a lighting system for emitting light in multiple directions including one or more light emitting devices (LEDs) and a housing configured to receive the one or more LEDs. The one or more LEDs are configured to generate light in a first direction to illuminate a first area proximate to the lighting system. The housing is configured to reflect a portion of the generated light so as to allow a remaining portion of the generated light to pass through the housing in a second direction, different from the first direction, and illuminate a second area proximate to the lighting system. Related methods are also provided herein.
摘要翻译： 本发明的一些实施例提供了一种用于在多个方向上发射光的照明系统，包括一个或多个发光装置（LED）和被配置为接收一个或多个LED的壳体。 一个或多个LED被配置为在第一方向上产生光以照亮靠近照明系统的第一区域。 壳体被配置为反射所产生的光的一部分，以便允许所生成的光的剩余部分沿与第一方向不同的第二方向穿过壳体，并且照亮靠近照明系统的第二区域。 本文还提供了相关方法。
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