Defect review apparatus and method for wafer
    1.
    发明授权
    Defect review apparatus and method for wafer 有权
    晶圆缺陷评估装置及方法

    公开(公告)号:US08339450B2

    公开(公告)日:2012-12-25

    申请号:US12614905

    申请日:2009-11-09

    申请人: Naohiro Takahashi

    发明人: Naohiro Takahashi

    IPC分类号: H04N7/18

    摘要: A defect review apparatus includes a storage device which stores data about a defect of an inspection target object; a first imaging device which captures an image located in a position on a surface of the inspection target object, the position being specified by information regarding the position of the inspection target object which has been input; and a control device which controls the first imaging device. The storage device stores: first defect detection data including a defect number as which the defect of the inspection target object detected by a first defect detection process is labeled, and information regarding the position of the defect; and second defect data including a defect number as which the defect of the inspection target object detected by a second defect detection process is labeled, and information regarding its position.

    摘要翻译: 缺陷检查装置包括存储关于检查目标对象的缺陷的数据的存储装置; 第一成像装置,其捕获位于所述检查对象物体的表面上的位置的图像,所述位置由关于被输入的检查对象物的位置的信息指定; 以及控制第一成像装置的控制装置。 存储装置存储:包括通过第一缺陷检测处理检测到的检查对象物体的缺陷被标记的缺陷数的第一缺陷检测数据和关于缺陷的位置的信息; 并且包括通过第二缺陷检测处理检测到的检查对象对象的缺陷被标记的缺陷数的第二缺陷数据以及关于其位置的信息。

    SENSOR APPARATUS AND INFORMATION PROCESSING APPARATUS
    2.
    发明申请
    SENSOR APPARATUS AND INFORMATION PROCESSING APPARATUS 有权
    传感器装置和信息处理装置

    公开(公告)号:US20120068965A1

    公开(公告)日:2012-03-22

    申请号:US13228686

    申请日:2011-09-09

    IPC分类号: G06F3/045

    CPC分类号: G06F3/044 G06F3/0414

    摘要: A sensor apparatus includes: a sensor panel that includes an input operation surface and is configured to detect positional coordinates of a detection object that comes into contact with the input operation surface; a casing; and a pressure-sensitive sensor that includes a first electrode fixed on the sensor panel side, a second electrode fixed on the casing side, and an elastic member that is provided between the sensor panel and the casing and elastically supports the sensor panel with respect to the casing, includes, between the first electrode and the second electrode, a first area formed with a first capacitance and a second area formed with a second capacitance larger than the first capacitance, and is configured to detect a pressing force input to the input operation surface as a change in a capacitance between the first electrode and the second electrode.

    摘要翻译: 传感器装置包括:传感器面板,包括输入操作面,被配置为检测与输入操作面接触的检测对象的位置坐标; 套管 以及压敏传感器,其包括固定在所述传感器面板侧的第一电极,固定在所述壳体侧的第二电极和设置在所述传感器面板与所述壳体之间的弹性部件,并相对于所述传感器面板弹性地支撑所述传感器面板 壳体在第一电极和第二电极之间包括形成有第一电容的第一区域和形成有大于第一电容的第二电容的第二区域,并且被配置为检测输入到输入操作的按压力 表面作为第一电极和第二电极之间的电容的变化。

    METHOD, SYSTEM AND APPARATUS OF INSPECTION
    3.
    发明申请
    METHOD, SYSTEM AND APPARATUS OF INSPECTION 有权
    方法,系统和检查装置

    公开(公告)号:US20080165352A1

    公开(公告)日:2008-07-10

    申请号:US11971384

    申请日:2008-01-09

    IPC分类号: G01N21/00

    CPC分类号: G01N21/9501 G01N21/4738

    摘要: A method of inspecting defects on an object includes irradiating predetermined particles with a laser beam to measure first scattered light intensities, irradiating plural types of defects with the laser beam to measure second scattered light intensities, determining types of some defects selected out of the plural types of defects using the first scattered light intensities, setting a discrimination line indicating a boundary value of the second scattered light intensities based on the determination, and discriminating, using the discrimination line, defects on the object.

    摘要翻译: 检查物体上的缺陷的方法包括用激光束照射预定粒子以测量第一散射光强度,用激光束照射多种类型的缺陷以测量第二散射光强度,确定多种类型中选择的某些缺陷的类型 使用第一散射光强度的缺陷,基于该确定来设置表示第二散射光强度的边界值的判别线,以及使用判别线识别物体上的缺陷。

    Semiconductor wafer defect inspection method and apparatus
    4.
    发明申请
    Semiconductor wafer defect inspection method and apparatus 审中-公开
    半导体晶圆缺陷检查方法及装置

    公开(公告)号:US20080073523A1

    公开(公告)日:2008-03-27

    申请号:US11600855

    申请日:2006-11-17

    IPC分类号: G01N23/00

    摘要: A semiconductor wafer whose position information on defects on a surface of the semiconductor wafer is already known, is placed on a stage of an imaging apparatus. Positions in a height direction of a plurality points on the surface of the semiconductor wafer are measured. In accordance with the measured positions in the height direction, the surface is partitioned into a plurality of partial areas. One partial area for which images of defects are still not acquired, is selected from the partial areas. The height of the stage is adjusted so as to set the selected partial area in an auto focusing range. Defects in the selected partial area are imaged with the imaging apparatus to acquire images of defects. Steps between the step of selecting the partial area and the step of acquiring the images of defects are repeated until images of defects in all partial areas are acquired.

    摘要翻译: 将半导体晶片的表面上的缺陷的位置信息已知的半导体晶片放置在成像装置的台上。 测量半导体晶片的表面上的多个点的高度方向的位置。 根据高度方向上的测量位置,将表面划分为多个局部区域。 从部分区域中选择一个部分区域,其中仍未获取缺陷图像。 调整舞台的高度,以便将所选择的部分区域设置在自动对焦范围内。 所选部分区域中的缺陷用成像装置成像以获得缺陷图像。 重复选择部分区域的步骤和获取缺陷图像的步骤之间的步骤,直到获取所有部分区域中的缺陷的图像。

    Inspecting method, inspecting apparatus, and method of manufacturing semiconductor device
    5.
    发明申请
    Inspecting method, inspecting apparatus, and method of manufacturing semiconductor device 有权
    检查方法,检查装置以及制造半导体器件的方法

    公开(公告)号:US20070255513A1

    公开(公告)日:2007-11-01

    申请号:US11588319

    申请日:2006-10-27

    IPC分类号: G06F19/00 G06F17/40

    CPC分类号: G01N21/9501 G01N21/9503

    摘要: An inspecting method is capable of efficiently inspecting a wafer. According to the inspecting method, the chip area of a wafer is inspected for defects, and based on the results, a defect density D0p of each of peripheral-zone chips in the chip area which are located closely to the peripheral area of the wafer is calculated. A peripheral-zone chip with a high defect density D0p is selected, and an area in the peripheral area which is outward of the selected peripheral-zone chip is inspected for defects. Since only the area in the peripheral area which is located outward of the peripheral-zone chip selected based on the defect density D0p is inspected for defects, the wafer is inspected efficiently.

    摘要翻译: 检查方法能够有效地检查晶片。 根据检查方法,检查晶片的芯片面积的缺陷,并且基于该结果,芯片区域中的每个周边区域芯片的缺陷密度D 0p 位于紧密的位置 计算晶圆的外围区域。 选择具有高缺陷密度D <0P 的周边区域芯片,并且检查在所选周边区域芯片外部的周边区域中的缺陷。 由于仅考虑了基于缺陷密度D 0p <0>的所选外围区域芯片周边区域的区域,故有效地检查晶片。

    Defect inspection apparatus and method of defect inspection
    6.
    发明申请
    Defect inspection apparatus and method of defect inspection 有权
    缺陷检查装置及缺陷检查方法

    公开(公告)号:US20070230769A1

    公开(公告)日:2007-10-04

    申请号:US11511398

    申请日:2006-08-29

    IPC分类号: G06K9/00

    CPC分类号: G06K9/68

    摘要: A first defect classification section uses a pre-inspection test target as the inspected piece, and classifies the defects, based on results of the defect inspection executed a plurality of times by the defect detection system, into first defects detected constantly in each of the plurality of times of inspection, and into second defects detected only in a part of, but not in the residual part of the plurality of times of inspection.

    摘要翻译: 第一缺陷分类部使用预检测试对象作为被检查部,并且基于缺陷检测系统多次执行的缺陷检查的结果,将缺陷分类为在多个检测对象中不断检测到的第一缺陷 的检查次数,并且检测到仅在多次检查的一部分但不在剩余部分中检测到的第二缺陷。

    Holder for mounting an air bag module
    7.
    发明授权
    Holder for mounting an air bag module 有权
    用于安装气囊模块的支架

    公开(公告)号:US06422590B1

    公开(公告)日:2002-07-23

    申请号:US09940275

    申请日:2001-08-28

    IPC分类号: B60R2116

    CPC分类号: B60R21/207

    摘要: A holder for mounting an air bag module, the holder including a bottomed, substantially box-like body having a peripheral wall and an opening, the holder adapted to be fastened to a side plate of a seat back frame in a cavity of a back pad with the opening thereof facing a body of an automotive vehicle and with a bottom plate section thereof being applied to the side plate, and wrapped at the peripheral wall thereof by margin pieces which are provided around an opening portion in a side of a seat cover, rolled in the holder from the opening of the holder, and fastened to the holder, the air bag module having an air bag housed within an air bag case, the air bag module adapted to be incorporated in the holder and fastened to the side plate through the holder, whereby the air bag module is installed in the side of the seat back, the holder further including flanges, and at least first and second brittle sections serving as breaking portions, the peripheral wall including a front side wall section facing a front side of the seat back, a rear side wall section facing a rear side of the seat back, an upper side wall section, and a lower side wall section, the flanges projecting outwardly from edges of the front, rear, upper and lower side wall sections, at least a flange portion of the front side wall section having a thin metal plate embedded in an inner surface thereof, whereby the flange is reinforced by the metal plate, the first brittle section provided at a corner between the front side wall section and the upper wall section, and at a corner between the flange of the front side wall section and a flange of the upper wall section, and the second brittle section provided at a corner between the front side wall section and the lower wall section, and at a corner between the flange of the front side wall section and a flange of the lower wall section.

    摘要翻译: 一种用于安装气囊模块的保持器,所述保持器包括具有周壁和开口的有底的基本上为盒状的本体,所述保持器适于紧固在靠背框架的座中的座椅靠背框架的侧板上 其开口面向机动车辆的主体,并且其底板部分被施加到侧板,并且在其周壁上由围绕座套的侧面的开口部分设置的边缘片包裹, 从保持器的开口滚动保持器,并将其紧固到保持器,气囊模块具有容纳在安全气囊壳体内的气囊,气囊模块适于结合在保持器中并通过 所述保持器,其中所述气囊模块安装在所述座椅靠背的侧部,所述保持器还包括凸缘,并且至少第一和第二脆性部分用作断裂部分,所述周壁包括前侧瓦 其面向座椅靠背的前侧,面向座椅靠背的后侧的后侧壁部,上侧壁部和下侧壁部,所述凸缘从前后的边缘向外突出, 上侧壁部和下侧壁部,至少前侧壁部的凸缘部具有嵌入其内表面的薄金属板,由此凸缘被金属板加强,第一脆性部设置在第一脆性部 前侧壁部和上壁部以及前侧壁部的凸缘与上壁部的凸缘之间的角部,以及设置在前侧壁部与下侧壁之间的角部的第二脆性部 壁部,以及前侧壁部的凸缘与下壁部的凸缘之间的角部。

    Side-collision air bag device
    8.
    发明授权
    Side-collision air bag device 失效
    侧面碰撞气囊装置

    公开(公告)号:US06386577B1

    公开(公告)日:2002-05-14

    申请号:US09533972

    申请日:2000-03-23

    IPC分类号: B60R2122

    摘要: A module case having an air bag module accommodated therein is disposed in a side face of a seat back, so that a lid of the module case is opened by a pressure of an air bag expanded upon a side collision of a vehicle, and the air bag is deployed through the resulting opening, termed the “primary” opening into a vehicle compartment. As a result of a tear line provided in the module case, even if the lid is held down by the door which has been deformed by a shock resulting from the collision, so that the lid cannot be opened to provide the primary opening, the tear line in a case body of the module case is broken, whereby a front wall is pivoted forwardly to form an alternate or “secondary” opening from the module case. Therefore, the air bag can be deployed without hindrance through the alternate secondary opening defined in the front wall of the module case into the vehicle compartment.

    摘要翻译: 在座椅靠背的侧面设置有容纳有气囊模块的模块壳体,通过在车辆的侧面碰撞时膨胀的气囊的压力打开模块壳体的盖,空气 袋通过所形成的开口部署,称为“主要”开口进入车厢。 由于设置在模块壳体中的撕裂线,即使盖被由于碰撞引起的震动而变形的门盖住,使得盖子不能打开以提供主开口,撕裂 模块壳体的壳体中的线被破坏,由此前壁向前枢转以形成从模块壳体的交替或“次”开口。 因此,可以通过限定在模块壳体的前壁中的备用二次开口将气囊展开而不受妨碍地进入车厢。