公开(公告)号：US3428858A

公开(公告)日：1969-02-18

申请号：US3428858D

申请日：1965-09-07

Applicant: NICHOLAS D GLYPTIS

Inventor： GLYPTIS NICHOLAS D

IPC: H01J29/80 ,  H01J31/12 ,  H01J31/20 ,  H04N9/26 ,  H01J29/52

CPC classification number: H01J31/12 ,  H01J29/80 ,  H01J29/803 ,  H01J31/201 ,  H04N9/26

公开(公告)号：US3651306A

公开(公告)日：1972-03-21

申请号：US3651306D

申请日：1969-04-28

Applicant: NICHOLAS D GLYPTIS

Inventor： GLYPTIS NICHOLAS D

IPC: B23K3/02 ,  B23K3/047 ,  B23K3/06 ,  H05B3/12 ,  B23K3/04

CPC classification number: B23K3/0615 ,  B23K3/025 ,  B23K3/047 ,  B23K2201/42 ,  Y10T428/12042 ,  Y10T428/1216 ,  Y10T428/12715

Abstract: A porous metal element, e.g., porous bronze, such as a mass of sintered tin-coated copper spheres, filled with a solder base material, is used as an element in a soldering device for delivering solder to the place where needed. The porous material is usually about 40-50 percent by volume, or more, interconnected voids and the voids are preferably completely filled with the solder base material to the exclusion of air. The soldering element is maintained filled with solder by surface tension while the solder is in molten condition during use of the device. The soldering element may be in the form of a tip on a soldering gun or soldering iron, or in the form of a stamping plate for stamping printed circuits or any other convenient form.

Abstract translation: 使用填充有焊料基材的多孔金属元件，例如多孔青铜，例如大量的烧结的锡涂覆的铜球，用作用于将焊料输送到需要的地方的焊接装置中的元件。 多孔材料通常为约40-50体积％或更多的互连空隙，并且空隙优选完全用焊料基材填充以排除空气。 焊接元件在使用设备期间焊料处于熔融状态时，通过表面张力保持充满焊料。 焊接元件可以是在焊枪或烙铁上的尖端的形式，或者用于冲压印刷电路或任何其它方便形式的冲压板的形式。

公开(公告)号：US3430060A

公开(公告)日：1969-02-25

申请号：US3430060D

申请日：1965-10-22

Applicant: NICHOLAS D GLYPTIS

Inventor： GLYPTIS NICHOLAS D

IPC: H02J9/06 ,  H02M1/10 ,  H02J7/02

CPC classification number: H02J9/062 ,  H02M1/10 ,  Y10T307/391 ,  Y10T307/625