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12 条记录 (耗时 0.012 秒)

    PORTABLE ELECTRICAL DEVICE AND ITS MANUFACTURING METHOD
    3.
    发明申请
    PORTABLE ELECTRICAL DEVICE AND ITS MANUFACTURING METHOD 审中-公开
    便携式电气设备及其制造方法

    公开(公告)号：US20120262344A1

    公开(公告)日：2012-10-18

    申请号：US13241319

    申请日：2011-09-23

    申请人： Ming-Hsueh Tsai ,  Ying-Chih Wang ,  Chien-Chiang Huang ,  Hsien-Ming Wu

    发明人： Ming-Hsueh Tsai ,  Ying-Chih Wang ,  Chien-Chiang Huang ,  Hsien-Ming Wu

    IPC分类号： H01Q1/24 ,  B29C45/14

    CPC分类号： H01Q1/2266 ,  G06F1/1698

    摘要： A portable electrical device includes a chassis, a plurality of conductive bodies, a wireless RF module and a cable. The chassis includes a casing layer and a radiator layer stacked with each other. The conductive bodies are embedded inside the casing layer, in which one end of each conductive body exposes outwards one surface of the plastic casing layer, and the other end of each conductive body exposes outwards the other surface of the casing layer and electrically conducts the radiator layer. The cable is electrically conducted with the conductive bodies and the wireless RF module.

    摘要翻译： 便携式电气设备包括底盘，多个导电体，无线RF模块和电缆。 底盘包括彼此堆叠的外壳层和散热器层。 导电体嵌入到壳体层内，每个导电体的一端向外暴露塑料外壳层的一个表面，并且每个导电体的另一端向外暴露于外壳层的另一个表面，并将散热器 层。 电缆与导电体和无线RF模块电连接。

    Electronic device with improved cooling mechanism
    7.
    发明申请
    Electronic device with improved cooling mechanism 审中-公开
    具有改善冷却机制的电子设备

    公开(公告)号：US20060249280A1

    公开(公告)日：2006-11-09

    申请号：US11398315

    申请日：2006-04-05

    申请人： Chung-Ping Chuang ,  Ming-Hsueh Tsai ,  Cheng-Chieh Chuang

    发明人： Chung-Ping Chuang ,  Ming-Hsueh Tsai ,  Cheng-Chieh Chuang

    IPC分类号： F28F7/00 ,  F28D15/00

    CPC分类号： H01L23/4006 ,  H01L23/367 ,  H01L23/42 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2924/0002 ,  H05K7/20436 ,  H01L2924/00

    摘要： An electronic device includes a substrate, a processor, and a cooling mechanism. The processor is disposed on the substrate. The cooling mechanism includes a conductive medium, a cooling plate and a protrusion. The conductive medium contacts the processor. The cooling plate contacts the conduction medium. The protrusion protruding from the cooling plate connects the substrate to define and maintain a distance between the substrate and the cooling plate. Thus, the contact between the processor, the conductive medium, and the cooling plate are tightly maintained.

    摘要翻译： 电子设备包括基板，处理器和冷却机构。 处理器设置在基板上。 冷却机构包括导电介质，冷却板和突起。 导电介质接触处理器。 冷却板接触导电介质。 从冷却板突出的突起连接基板以限定并保持基板和冷却板之间的距离。 因此，处理器，导电介质和冷却板之间的接触被紧密地保持。

    Shock-resistant container
    8.
    发明授权
    Shock-resistant container 有权
    防震容器

    公开(公告)号：US6082546A

    公开(公告)日：2000-07-04

    申请号：US209422

    申请日：1998-12-11

    申请人： Chung-Chi Liao ,  Ming-Hsueh Tsai ,  Tai-Ling Chan

    发明人： Chung-Chi Liao ,  Ming-Hsueh Tsai ,  Tai-Ling Chan

    IPC分类号： B65D71/70 ,  B65D81/02

    CPC分类号： B65D71/70 ,  B65D81/025

    摘要： The present invention provides a container for a product, which comprises: a bottom portion; side walls connected to edges of the bottom portion; at least one first supporting portion protruding from the bottom portion of the container. The first supporting portion includes at least one convex surface to support the product, at least one concave surface, and a side surface, and both the convex surface and the concave surface are connected to the side surface. When the product is received within the container, the convex surface can support the product, and the product is spaced apart from the concave surface; thus, the cushioning effect of the container is greatly improved.

    摘要翻译： 本发明提供一种用于产品的容器，其包括：底部; 连接到底部的边缘的侧壁; 至少一个从容器的底部突出的第一支撑部分。 第一支撑部分包括至少一个用于支撑产品的凸表面，至少一个凹面和侧表面，并且凸表面和凹表面两者连接到侧表面。 当产品被容纳在容器内时，凸面可以支撑产品，产品与凹面间隔开; 因此，容器的缓冲效果大大提高。