公开(公告)号：US06591703B2

公开(公告)日：2003-07-15

申请号：US09847456

申请日：2001-05-02

Applicant: Ernst Gass ,  Michael Fritton ,  Josef Mayer ,  Walter Roth

Inventor： Ernst Gass ,  Michael Fritton ,  Josef Mayer ,  Walter Roth

IPC: G01D2100

CPC classification number: H05K5/064 ,  G01D11/245 ,  Y10T29/49007

Abstract: A sensor has a housing, in which there is arranged a thermosetting molding compound which is encapsulated in a linear region in the longitudinal direction of the housing by a thermoplastic molding compound. The two molding compounds meet at a conical contact surface. An electrical terminal element is electrically connected to a printed-circuit board via lines. The printed-circuit board is embedded into the two molding compounds at the level of the center line, the thermosetting molding compound enclosing all the electrically active components and conductor tracks of the printed-circuit board. Annular grooves are arranged on the outer side of the thermosetting molding compound. Due to the encapsulation, the thermoplastic molding compound engages in these annular grooves in a positively and non-positively engaging manner. The groove arrangement has the advantage that effective sealing is ensured both when there is an increase in the temperature and when there is a decrease in the temperature of the sensor, since either the one groove surfaces or the other groove surfaces provide effective sealing on account of the respectively differing material expansion of the two molding compounds.

Abstract translation: 传感器具有壳体，其中布置有通过热塑性模塑料封装在壳体的纵向方向上的线性区域中的热固性模塑料。 两个模制化合物在锥形接触表面相遇。 电气端子元件通过线路电连接到印刷电路板。 将印刷电路板嵌入两个模制化合物的中心线的水平面上，该热固性模塑料封装印刷电路板的所有电活性组件和导体轨迹。 环状槽布置在热固性模塑料的外侧上。 由于封装，热塑性模塑料以正非接触的方式接合在这些环形槽中。 槽布置的优点在于，当温度升高和传感器的温度降低时确保有效的密封，因为一个凹槽表面或另一个凹槽表面提供有效的密封，因为 两种模塑料的分别不同的材料膨胀。