公开(公告)号：US4564424A

公开(公告)日：1986-01-14

申请号：US600833

申请日：1984-04-16

申请人： Robert Cassat ,  Maurice Alliot-Lugaz

发明人： Robert Cassat ,  Maurice Alliot-Lugaz

IPC分类号： B32B15/08 ,  B32B15/088 ,  C08K3/22 ,  C08L67/00 ,  C08L67/02 ,  C08L71/12 ,  C08L77/00 ,  C08L79/04 ,  C08L81/02 ,  C08L101/00 ,  C23C18/20 ,  C23C18/22 ,  C23C18/31 ,  C25D5/56 ,  H05K3/06 ,  H05K3/18

CPC分类号： H05K3/188 ,  C25D5/56 ,  Y10T428/12569 ,  Y10T428/31504

摘要： Electrically insulating polymeric film substrates are conductively metallized, e.g., to provide base members useful in the fabrication of printed circuits and the like, by (1) shaping into such film substrate an intimate homogeneous admixture of a film-forming polymer matrix having from 10 to 70 percent by total weight of said admixture of finely divided, non-conductive metal oxide particles uniformly distributed therein, (2) disrupting at least one face surface of said shaped film substrate to expose thereon a plurality of said finely divided, non-conductive metal oxide particles, (3) treating said at least one disrupted face surface with a preferably borohydride reducing agent to reduce said exposed metal oxide particles into a layer of electrically conductive free metal, whereby said at least one face surface is rendered electrically conductive, and, advantageously, (4) eletrolytically depositing a reinforcing, electrically conductive metallic overlayer atop said first layer of electrically conductive free metal.

摘要翻译： 电绝缘性聚合物膜基材是导电金属化的，例如，通过（1）将这种成膜聚合物基质的均匀混合物形成为具有10至10的成膜聚合物基质，从而提供用于制造印刷电路等的基底部件 均匀分布在其中的所述细分散的非导电性金属氧化物颗粒的混合物的总重量的70重量％，（2）破坏所述成形薄膜基材的至少一个表面以在其上暴露多个所述细碎的非导电金属 氧化物颗粒，（3）用优选硼氢化还原剂处理所述至少一个破坏的面表面，以将所述暴露的金属氧化物颗粒减少为导电的自由金属层，由此所述至少一个面表面导电， 有利地，（4）电解沉积在所述第一层电极上方的增强导电金属覆层 导电性无源金属。