摘要:
Structures for light emitting diodes are disclosed, which include improved current blocking and light extraction structures. The diodes typically include a substrate formed on a first electrode, a first confining layer of a first conductivity type formed on the substrate, an active region formed on the first confining layer, a second confining layer of a second conductivity type formed on the active region, and a window layer of the second conductivity type formed on the second confining layer. A contact layer of the second conductivity type is formed on the window layer for making ohmic contact, a conductive oxide layer is formed on the contact layer, and a second electrode is formed on the conductive oxide layer. The conductive oxide layer typically includes a central portion located below the second top electrode, which extends into the LED structure, typically beyond the contact layer and into the window layer, or even beyond the window layer, such as into the second confining layer. The improved LED structures preferably include a higher resistive or reverse biased pattern, typically built on or within the substrate, approximately below the second electrode, to further assist the current blocking function. The light emitting diodes preferably include one or more holes which are defined in the conductive oxide layer, or within both the conductive oxide layer and the contact layer, to promote the transmission of light from the upper surface of the light emitting diode. A Distributed Bragg Reflector is also preferably provided between the lower substrate and the first confining layer, to reduce light absorption within the substrate, and to promote efficient light extraction from the top of the LED structure.
摘要:
A method of minimizing stress within large area semiconductor devices which utilize a GaAs substrate and one or more thick layers of AlxGa1-xAs is provided, as well as the resultant device. In general, each thick AlxGa1-xAs layer within the semiconductor structure is replaced, during the structure's fabrication, with an AlxGa1-xAszP1-z layer of approximately the same thickness and with the same concentrations of Al and Ga. The AlxGa1-xAszP1-z layer is lattice matched to the GaAs substrate by replacing a small percentage of the As in the layer with P.
摘要翻译:提供了利用GaAs衬底和一个或多个厚层的Al x Ga 1-x As As的大面积半导体器件内的应力最小化的方法,以及 结果装置。 通常,半导体结构中的每个厚的Al x Al x Ga 1-x O As层在结构的制造期间被替换为Al x 大约相同厚度和相同浓度的Al和Ga的Ga 1-x S 1 z z 1 1 z z层,Al < 通过代替小的GaN层,与GaN衬底晶格匹配, As在与P的层中的百分比
摘要:
A means of controlling the stress in a laser diode structure through the use of AlGaAsP is provided. Depending upon the amount of phosphorous in the material, it can be used to either match the lattice constant of GaAs, thus forming a strainless structure, or mismatch the lattice constant of GaAs, thereby adding tensile stress to the structure. Tensile stress can be used to mitigate the compressive stress due to material mismatches within the structure (e.g., a highly strained compressive quantum well), or due to the heat sink bonding procedure.
摘要:
A semiconductor laser and a method of forming the same are provided. The semiconductor laser includes cladding layers comprised of hybrid materials systems which have different conduction to valance band gap offset ratios with respect to GaAs. As a result of these hybrid structures, lower junction voltages on both the n-side and p-side of the laser structure are achieved, thereby increasing the electrical to optical conversion efficiency of the laser.