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公开(公告)号:US20140150243A1
公开(公告)日:2014-06-05
申请号:US13836912
申请日:2013-03-15
Applicant: Marek Mamczur
Inventor: Marek Mamczur
CPC classification number: B23B5/28 , B23B1/00 , B23B25/06 , B23B2215/08 , B23Q15/013 , G05B19/401 , G05B2219/32228 , G05B2219/37398 , G05B2219/50214 , Y10T29/49986 , Y10T82/10 , Y10T82/18
Abstract: An apparatus for recutting the surface of a wheel is described. The apparatus comprises a rotatable mount, for holding and rotating the wheel about its axis, a surface profiler, configured to detect and output a surface elevation profile of a concentric ring at a current radial position on the surface of the wheel, a linear drive mechanism, configured to reposition the surface profiler radially with respect to the wheel, a radial profile generator, configured to calculate a cutting profile for the wheel based on the surface elevation profile for each concentric ring, a cutting tool, and cutting control circuitry, configured to control the position of the cutting tool with respect to the wheel to recut the surface of the wheel in accordance with the generated cutting profile.
Abstract translation: 描述了一种用于重新研磨车轮表面的装置。 该装置包括用于保持和旋转车轮绕其轴线的可旋转的安装件,表面轮廓仪,被配置为检测并输出在车轮表面上的当前径向位置的同心环的表面仰角轮廓;线性驱动机构 ,其被配置为相对于所述车轮径向地重新定位所述表面轮廓仪;径向轮廓发生器,被配置为基于每个同心环的表面仰角轮廓计算所述车轮的切割轮廓,切割工具和切割控制电路, 根据生成的切割轮廓来控制切割工具相对于轮的位置,以重新查看车轮的表面。