公开(公告)号：US20240298834A1

公开(公告)日：2024-09-12

申请号：US18668057

申请日：2024-05-17

Applicant: MTP Technologies, LLC

Inventor： Michael T. POULTON

IPC: A47J27/00 ,  A23L5/10 ,  A47J36/32 ,  G01J5/00 ,  G01J5/48 ,  G01K7/00 ,  G01K13/00 ,  G01N21/31 ,  G05D23/19 ,  H05B1/02 ,  H05B3/00

CPC classification number: A47J27/004 ,  A23L5/12 ,  A23L5/15 ,  A47J36/321 ,  G01J5/00 ,  G01K13/00 ,  G01N21/31 ,  G05D23/1917 ,  H05B1/0261 ,  H05B3/0004 ,  H05B3/0076 ,  A23V2002/00 ,  G01J2005/0077 ,  G01J5/485 ,  G01K7/00 ,  G01K2207/06

Abstract: Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

公开(公告)号：US11426022B2

公开(公告)日：2022-08-30

申请号：US17397791

申请日：2021-08-09

Applicant: MTP Technologies, LLC

Inventor： Michael T. Poulton

IPC: A47J27/00 ,  A23L5/10 ,  A47J36/32 ,  G05D23/19 ,  H05B1/02 ,  H05B3/00 ,  G01N21/31 ,  G01J5/00 ,  G01K13/00 ,  G01J5/48

Abstract: Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

公开(公告)号：US11986119B2

公开(公告)日：2024-05-21

申请号：US17815167

申请日：2022-07-26

Applicant: MTP Technologies, LLC

Inventor： Michael T. Poulton

IPC: G01K7/00 ,  A23L5/10 ,  A47J27/00 ,  A47J36/32 ,  G01J5/00 ,  G01K13/00 ,  G01N21/31 ,  G05D23/19 ,  H05B1/02 ,  H05B3/00 ,  G01J5/48

CPC classification number: A47J27/004 ,  A23L5/12 ,  A23L5/15 ,  A47J36/321 ,  G01J5/00 ,  G01K13/00 ,  G01N21/31 ,  G05D23/1917 ,  H05B1/0261 ,  H05B3/0004 ,  H05B3/0076 ,  A23V2002/00 ,  G01J2005/0077 ,  G01J5/485 ,  G01K7/00 ,  G01K2207/06

Abstract: Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

公开(公告)号：US20220369844A1

公开(公告)日：2022-11-24

申请号：US17815167

申请日：2022-07-26

Applicant: MTP Technologies, LLC

Inventor： Michael T. POULTON

IPC: A47J27/00 ,  A23L5/10 ,  A47J36/32 ,  G05D23/19 ,  H05B1/02 ,  H05B3/00 ,  G01N21/31 ,  G01J5/00 ,  G01K13/00

Abstract: Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.