公开(公告)号：US11511524B2

公开(公告)日：2022-11-29

申请号：US17198796

申请日：2021-03-11

Applicant: LabForInvention

Inventor： Guowen Ding

IPC: C03C17/36 ,  B32B17/10 ,  B32B3/26

Abstract: Provided are novel energy-efficient signal-transparent window assemblies and methods of fabricating thereof. These window assemblies are specifically configured to allow selective penetration of electromagnetic wavelengths greater than 0.5 millimeters, representing current and future wireless signal spectrum. This signal penetration is provided while IR blocking properties are retained. Furthermore, the windows assemblies remain substantially transparent within the visible spectrum with no specific features detectable to the naked eye. This unique performance is achieved by patterning conductive layers such that the conductive layer edges remain protected during most fabrication steps and the fabrication. As such, the conductive layers are encapsulated and being separated from the environment while retaining separation between individual disjoined structures of these layers. For example, a barrier layer and/or a dielectric layer may extend over the conductive layer edge. The patterning is achieved by forming photoresist structures on the substrate and depositing a low-E stack over these photoresist structures.

公开(公告)号：US12005678B2

公开(公告)日：2024-06-11

申请号：US18045601

申请日：2022-10-11

Applicant: LabForInvention

Inventor： Guowen Ding

IPC: C03C17/36 ,  B32B17/10 ,  B32B3/26

CPC classification number: B32B17/10201 ,  B32B17/10192 ,  B32B17/10403 ,  C03C17/3618 ,  C03C17/366 ,  B32B3/266 ,  B32B17/10 ,  B32B2250/05 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2419/00 ,  Y10T428/24612

Abstract: Provided are novel energy-efficient signal-transparent window assemblies and methods of fabricating thereof. These window assemblies are specifically configured to allow selective penetration of electromagnetic wavelengths greater than 0.5 millimeters, representing current and future wireless signal spectrum. This signal penetration is provided while IR-blocking properties are retained. Furthermore, the window assemblies remain substantially transparent within the visible spectrum with no specific features detectable to the naked eye. This unique performance is achieved by patterning conductive layers such that the conductive layer edges remain protected during most fabrication steps and the fabrication. As such, the conductive layers are encapsulated and separated from the environment while retaining separation between individual disjoined structures of these layers. For example, a barrier layer and/or a dielectric layer may extend over the conductive layer edge. The patterning is achieved by forming photoresist structures on the substrate and depositing a low-E stack over these photoresist structures.

公开(公告)号：US20220221636A1

公开(公告)日：2022-07-14

申请号：US17647331

申请日：2022-01-06

Applicant: LabForInvention

Inventor： Guowen Ding

IPC: G02B5/20

Abstract: Provided are novel energy-efficient signal-transparent window assemblies and methods of fabricating thereof. These window assemblies are specifically configured to allow selective penetration of millimeter waves, representing current and future wireless signal spectrum. This signal penetration is provided while IR blocking properties are retained. Furthermore, the windows assemblies remain substantially transparent within the visible spectrum with no specific features detectable to the naked eye. This unique performance is achieved by patterning conductive layers such that the conductive layer edges remain protected during most fabrication steps and the fabrication. As such, the conductive layers are encapsulated and being separated from the environment while retaining separation between individual disjoined structures of these layers. For example, a barrier layer and/or a dielectric layer may extend over the conductive layer edge. The patterning is achieved by forming spacers on the substrate and depositing a stack over these photoresist structures. The spacers are removed thereafter.

公开(公告)号：US20230056114A1

公开(公告)日：2023-02-23

申请号：US18045601

申请日：2022-10-11

Applicant: LabForInvention

Inventor： Guowen Ding

IPC: B32B17/10 ,  C03C17/36

Abstract: Provided are novel energy-efficient signal-transparent window assemblies and methods of fabricating thereof. These window assemblies are specifically configured to allow selective penetration of electromagnetic wavelengths greater than 0.5 millimeters, representing current and future wireless signal spectrum. This signal penetration is provided while IR-blocking properties are retained. Furthermore, the window assemblies remain substantially transparent within the visible spectrum with no specific features detectable to the naked eye. This unique performance is achieved by patterning conductive layers such that the conductive layer edges remain protected during most fabrication steps and the fabrication. As such, the conductive layers are encapsulated and separated from the environment while retaining separation between individual disjoined structures of these layers. For example, a barrier layer and/or a dielectric layer may extend over the conductive layer edge. The patterning is achieved by forming photoresist structures on the substrate and depositing a low-E stack over these photoresist structures.

公开(公告)号：US20210283884A1

公开(公告)日：2021-09-16

申请号：US17198796

申请日：2021-03-11

Applicant: LabForInvention

Inventor： Guowen Ding

IPC: B32B17/10

Abstract: Provided are novel energy-efficient signal-transparent window assemblies and methods of fabricating thereof. These window assemblies are specifically configured to allow selective penetration of electromagnetic wavelengths greater than 0.5 millimeters, representing current and future wireless signal spectrum. This signal penetration is provided while IR blocking properties are retained. Furthermore, the windows assemblies remain substantially transparent within the visible spectrum with no specific features detectable to the naked eye. This unique performance is achieved by patterning conductive layers such that the conductive layer edges remain protected during most fabrication steps and the fabrication. As such, the conductive layers are encapsulated and being separated from the environment while retaining separation between individual disjoined structures of these layers. For example, a barrier layer and/or a dielectric layer may extend over the conductive layer edge. The patterning is achieved by forming photoresist structures on the substrate and depositing a low-E stack over these photoresist structures.