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公开(公告)号:US09080228B2
公开(公告)日:2015-07-14
申请号:US14234964
申请日:2012-09-14
申请人: Keiichiro Oishi , Kouichi Suzaki
发明人: Keiichiro Oishi , Kouichi Suzaki
IPC分类号: C22C9/02 , C22C21/10 , B21B1/22 , B21B3/00 , C22C9/04 , C22F1/00 , C22F1/08 , H01B1/02 , C22C13/00
摘要: An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70% or more.
摘要翻译: 铜合金板的一方面,含有5.0质量%〜12.0质量%的Zn,Sn:1.1质量%〜2.5质量%,P:0.01质量%〜0.09质量%,Ni:0.6质量%〜1.5质量% 的Cu和不可避免的杂质,满足20≦̸ [Zn] + 7×[Sn] + 15×[P] + 4.5×[Ni]≦̸ 32的关系。 铜合金板的方面是使用冷轧精轧方法制造的,其中铜合金材料被冷轧,铜合金材料的平均晶粒直径为1.2μm至5.0μm,圆形或椭圆形 析出物存在于铜合金材料中,析出物的平均粒径为4.0nm〜25.0nm,析出物的粒径为4.0nm〜25.0nm的析出物的比例为70%以上。
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公开(公告)号:US20140255248A1
公开(公告)日:2014-09-11
申请号:US14234964
申请日:2012-09-14
申请人: Keiichiro Oishi , Kouichi Suzaki
发明人: Keiichiro Oishi , Kouichi Suzaki
IPC分类号: C22C21/10
摘要: An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70% or more.
摘要翻译: 铜合金板的一方面,含有5.0质量%〜12.0质量%的Zn,Sn:1.1质量%〜2.5质量%,P:0.01质量%〜0.09质量%,Ni:0.6质量%〜1.5质量% 的Cu和不可避免的杂质,满足20≦̸ [Zn] + 7×[Sn] + 15×[P] + 4.5×[Ni]≦̸ 32的关系。 铜合金板的方面是使用冷轧精轧方法制造的,其中铜合金材料被冷轧,铜合金材料的平均晶粒直径为1.2μm至5.0μm,圆形或椭圆形 析出物存在于铜合金材料中,析出物的平均粒径为4.0nm〜25.0nm,析出物的粒径为4.0nm〜25.0nm的析出物的比例为70%以上。
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